The Effect of Water-based Nanofluid Incorporating Al2O3 Nanoparticles on Heat Pipe Cooling Performance

  • Ismail A. Alzarooni

Student thesis: Master's Thesis


Heat pipe devices are recommended cooling methods for computer processors. However, to improve cooling technology in line with current advances, considerations of both the effectiveness and size of the microprocessor are imperative. Nanofluids manufactured using water and aluminum oxide nanoparticles of sizes between 40 and 50 nm are reported with significant thermal propagation compared to the use of water as a working fluid using a heat pipe device. The present research investigated the effect of a water-based nanofluid of different aluminum oxide nanoparticle concentrations on heat pipe cooling performance. The heat pipe vacuumed to almost absolute zero is filled with nanofluid. The pressure and temperature sensors tapered on heat pipe wall are situated to measure both saturation pressure and wall temperature, while heat is separately applied and rejected at the lower and the upper sections of an adiabatic section. After preparation of nanofluids using electromagnetic and sonication stirrers, the nanofluids were subjected to thermal and stability analysis, as well as microscopy experiments, before and after being subjected to heat pipe measurements. The thermal conductivity is calculated and applied to study the cooling effectiveness of the heat pipe. However, given the inconsistencies of heat pipe performance and after repetitive experiments, the heat pipe internal constituents such as nanoparticles, wick and surface of porous media required investigations using scan electron microscopy (SEM) imaging analysis. The SEM images revealed increased nanoparticle sizes, deposits on the wick and particle agglomerations of the heat pipe, which might account for the emerging blockage and inconsistencies in heat pipe performance.
Date of AwardDec 2014
Original languageAmerican English
SupervisorYoussef Shatilla (Supervisor)


  • Heat pipe
  • Nanofluid
  • Specific heat
  • Cooling performance
  • Scattering ability
  • Boiling point
  • Suspension.

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