Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions
- Yu Hin Chan
- , Jang Kyo Kim
- , D. Liu
- , C. K. Liu
- , Yiu Ming Cheung
- , Ming Wai Ng
- The Hong Kong University of Science and Technology
- ASM Assembly Automation Ltd.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1
Scopus
citations