Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions

Yu Hin Chan, Jang Kyo Kim, D. Liu, C. K. Liu, Yiu Ming Cheung, Ming Wai Ng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The wire bondability and surface characteristics were studied of Au/Ni bond pads on organic FR-4 PCBs with different gold plating schemes and gold thickness. Three different plating techniques were used to deposit gold layers, namely the electrolytic gold plating, immersion gold plating and immersion gold plating followed by electrolytic gold plating. Process windows for the individual metallisation schemes were established to optimize the wire bond force and bond power. Bond performance after wire bonding was evaluated based on the wire pull strength and wire deformation ratio. Various elemental and surface characterization techniques, such as SEM, optical profiler, XPS, nano-hardness test and surface energy analysis, were employed to characterize the bond pad surfaces, which were then correlated to the wire bond performance. The effects of plasma treatment using Ar and O2 gases were also studied.

Original languageBritish English
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages69-76
Number of pages8
ISBN (Electronic)078037682X, 9780780376823
DOIs
StatePublished - 2002
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20026 Dec 2002

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Conference

Conference4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Country/TerritoryTaiwan, Province of China
CityKaohsiung
Period4/12/026/12/02

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