@inproceedings{f56ead1a018e44a6973221e6a0bbedaa,
title = "Wire bondability of Au/Ni bond pads: Effects of metallisation schemes and processing conditions",
abstract = "The wire bondability and surface characteristics were studied of Au/Ni bond pads on organic FR-4 PCBs with different gold plating schemes and gold thickness. Three different plating techniques were used to deposit gold layers, namely the electrolytic gold plating, immersion gold plating and immersion gold plating followed by electrolytic gold plating. Process windows for the individual metallisation schemes were established to optimize the wire bond force and bond power. Bond performance after wire bonding was evaluated based on the wire pull strength and wire deformation ratio. Various elemental and surface characterization techniques, such as SEM, optical profiler, XPS, nano-hardness test and surface energy analysis, were employed to characterize the bond pad surfaces, which were then correlated to the wire bond performance. The effects of plasma treatment using Ar and O2 gases were also studied.",
author = "Chan, {Yu Hin} and Kim, {Jang Kyo} and D. Liu and Liu, {C. K.} and Cheung, {Yiu Ming} and Ng, {Ming Wai}",
note = "Funding Information: The authors wish to thank the Innovation and Technology Commission (ITC), Hong Kong SAR Government for the continuous support of this project through the Innovation and Technology Fund (UIT/32). Assistance with experiments rendered by the Materials Characterisation and Preparation Facilities (MCPF) at HKUST is also gratefully appreciated. Publisher Copyright: {\textcopyright} 2002 IEEE.; 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 ; Conference date: 04-12-2002 Through 06-12-2002",
year = "2002",
doi = "10.1109/EMAP.2002.1188815",
language = "British English",
series = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "69--76",
booktitle = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",
address = "United States",
}