WEEE, RoHS, and what you must do to get ready for lead-free electronics

Valérie Eveloy; Sanka Ganesan; Yuki Fukuda; Ji Wu; Michael G. Pecht

doi:10.1109/ICEPT.2005.1564718

WEEE, RoHS, and what you must do to get ready for lead-free electronics

Valérie Eveloy, Sanka Ganesan, Yuki Fukuda, Ji Wu, Michael G. Pecht

Mechanical & Nuclear Engineering

University of Maryland

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

16 Scopus citations

Abstract

The transition to lead-free electronics requires surmounting a host of technical, socio-political and economical issues. This paper discusses key concerns in lead-free product development, and provides guidelines to help equipment manufacturers efficiently implement a transition to lead-free electronics. The guidelines address key questions confronting the industry, including those related to lead-free compliance, lead-free part and supplier selection, lead-free manufacturing, and lead-free training and education.

Original language	British English
Title of host publication	2005 6th International Conference on Electronics Packaging Technology
Publisher	IEEE Computer Society
Pages	27-44
Number of pages	18
ISBN (Print)	0780394496, 9780780394490
DOIs	https://doi.org/10.1109/ICEPT.2005.1564718
State	Published - 2005
Event	2005 6th International Conference on Electronics Packaging Technology - Dameisha, Shenzhen, China Duration: 30 Aug 2005 → 2 Sep 2005

Publication series

Name	2005 6th International Conference on Electronics Packaging Technology
Volume	2005

Conference

Conference	2005 6th International Conference on Electronics Packaging Technology
Country/Territory	China
City	Dameisha, Shenzhen
Period	30/08/05 → 2/09/05

Keywords

Compliance
Implementation
Lead-free
Manufacturing
Reliability
RoHS
WEEE

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/ICEPT.2005.1564718

Cite this

Eveloy, V., Ganesan, S., Fukuda, Y., Wu, J., & Pecht, M. G. (2005). WEEE, RoHS, and what you must do to get ready for lead-free electronics. In 2005 6th International Conference on Electronics Packaging Technology (pp. 27-44). Article 1564718 (2005 6th International Conference on Electronics Packaging Technology; Vol. 2005). IEEE Computer Society. https://doi.org/10.1109/ICEPT.2005.1564718

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abstract = "The transition to lead-free electronics requires surmounting a host of technical, socio-political and economical issues. This paper discusses key concerns in lead-free product development, and provides guidelines to help equipment manufacturers efficiently implement a transition to lead-free electronics. The guidelines address key questions confronting the industry, including those related to lead-free compliance, lead-free part and supplier selection, lead-free manufacturing, and lead-free training and education.",

keywords = "Compliance, Implementation, Lead-free, Manufacturing, Reliability, RoHS, WEEE",

author = "Val{\'e}rie Eveloy and Sanka Ganesan and Yuki Fukuda and Ji Wu and Pecht, {Michael G.}",

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doi = "10.1109/ICEPT.2005.1564718",

language = "British English",

isbn = "0780394496",

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publisher = "IEEE Computer Society",

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note = "2005 6th International Conference on Electronics Packaging Technology ; Conference date: 30-08-2005 Through 02-09-2005",

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Eveloy, V, Ganesan, S, Fukuda, Y, Wu, J & Pecht, MG 2005, WEEE, RoHS, and what you must do to get ready for lead-free electronics. in 2005 6th International Conference on Electronics Packaging Technology., 1564718, 2005 6th International Conference on Electronics Packaging Technology, vol. 2005, IEEE Computer Society, pp. 27-44, 2005 6th International Conference on Electronics Packaging Technology, Dameisha, Shenzhen, China, 30/08/05. https://doi.org/10.1109/ICEPT.2005.1564718

WEEE, RoHS, and what you must do to get ready for lead-free electronics. / Eveloy, Valérie; Ganesan, Sanka; Fukuda, Yuki et al.
2005 6th International Conference on Electronics Packaging Technology. IEEE Computer Society, 2005. p. 27-44 1564718 (2005 6th International Conference on Electronics Packaging Technology; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Ganesan, Sanka

AU - Fukuda, Yuki

AU - Wu, Ji

AU - Pecht, Michael G.

PY - 2005

Y1 - 2005

N2 - The transition to lead-free electronics requires surmounting a host of technical, socio-political and economical issues. This paper discusses key concerns in lead-free product development, and provides guidelines to help equipment manufacturers efficiently implement a transition to lead-free electronics. The guidelines address key questions confronting the industry, including those related to lead-free compliance, lead-free part and supplier selection, lead-free manufacturing, and lead-free training and education.

AB - The transition to lead-free electronics requires surmounting a host of technical, socio-political and economical issues. This paper discusses key concerns in lead-free product development, and provides guidelines to help equipment manufacturers efficiently implement a transition to lead-free electronics. The guidelines address key questions confronting the industry, including those related to lead-free compliance, lead-free part and supplier selection, lead-free manufacturing, and lead-free training and education.

KW - Compliance

KW - Implementation

KW - Lead-free

KW - Manufacturing

KW - Reliability

KW - RoHS

KW - WEEE

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M3 - Conference contribution

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SN - 0780394496

SN - 9780780394490

T3 - 2005 6th International Conference on Electronics Packaging Technology

SP - 27

EP - 44

BT - 2005 6th International Conference on Electronics Packaging Technology

PB - IEEE Computer Society

T2 - 2005 6th International Conference on Electronics Packaging Technology

Y2 - 30 August 2005 through 2 September 2005

ER -

WEEE, RoHS, and what you must do to get ready for lead-free electronics

Abstract

Publication series

Conference

Keywords

UN SDGs

Access to Document

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Cite this