Warpage in plastic packages: Effects of process conditions, geometry and materials

Janet W.Y. Kong; Jang Kyo Kim; Matthew M.F. Yuen

doi:10.1109/TEPM.2003.820806

Warpage in plastic packages: Effects of process conditions, geometry and materials

Janet W.Y. Kong, Jang Kyo Kim, Matthew M.F. Yuen

Mechanical & Nuclear Engineering

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and coplanarity for a plastic package. Special emphasis is placed on the evaluation of moulding compound properties and optimal processing conditions that can effectively minimize warpage. It is found that moulding compounds requiring a low moulding temperature and having a low coefficient of thermal expansion (CTE) can significantly reduce warpage. The elastic modulus was found to be inversely proportional to warpage, indicating the modulus should be kept as high as possible. The post-mould curing is essential to reducing warpage as it increases the glass transition temperature, but lowers the thermal shrinkage. A cross-shaped die paddle against a full square paddle, a thick die attach and a large die size are also favorable to reducing warpage.

Original language	British English
Pages (from-to)	245-252
Number of pages	8
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	26
Issue number	3
DOIs	https://doi.org/10.1109/TEPM.2003.820806
State	Published - Jul 2003

Keywords

Coplanarity
Cross-shaped die paddle
CTE
Full square paddle
Glass transition temperature
Modulus
Moulding compounds
Plastic package
Post-mould curing
Thermal shrinkage
Warpage

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10.1109/TEPM.2003.820806

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title = "Warpage in plastic packages: Effects of process conditions, geometry and materials",

abstract = "The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and coplanarity for a plastic package. Special emphasis is placed on the evaluation of moulding compound properties and optimal processing conditions that can effectively minimize warpage. It is found that moulding compounds requiring a low moulding temperature and having a low coefficient of thermal expansion (CTE) can significantly reduce warpage. The elastic modulus was found to be inversely proportional to warpage, indicating the modulus should be kept as high as possible. The post-mould curing is essential to reducing warpage as it increases the glass transition temperature, but lowers the thermal shrinkage. A cross-shaped die paddle against a full square paddle, a thick die attach and a large die size are also favorable to reducing warpage.",

keywords = "Coplanarity, Cross-shaped die paddle, CTE, Full square paddle, Glass transition temperature, Modulus, Moulding compounds, Plastic package, Post-mould curing, Thermal shrinkage, Warpage",

author = "Kong, {Janet W.Y.} and Kim, {Jang Kyo} and Yuen, {Matthew M.F.}",

note = "Funding Information: Manuscript received August 1, 2003; revised October 1, 2003. This work was presented in part at the International Symposium on Electronic Materials and Packaging (EMAP2000), Singapore, September 2000. This work was supported by the Research Grant Council of the Hong Kong SAR (Project HKUST6014/98E), Research Infrastructure Grant (RI95/96.EG22), the Material Characterization and Preparation Facilities (MCPF), and EPack Laboratory, HKUST.",

year = "2003",

month = jul,

doi = "10.1109/TEPM.2003.820806",

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PY - 2003/7

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N2 - The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and coplanarity for a plastic package. Special emphasis is placed on the evaluation of moulding compound properties and optimal processing conditions that can effectively minimize warpage. It is found that moulding compounds requiring a low moulding temperature and having a low coefficient of thermal expansion (CTE) can significantly reduce warpage. The elastic modulus was found to be inversely proportional to warpage, indicating the modulus should be kept as high as possible. The post-mould curing is essential to reducing warpage as it increases the glass transition temperature, but lowers the thermal shrinkage. A cross-shaped die paddle against a full square paddle, a thick die attach and a large die size are also favorable to reducing warpage.

AB - The effects of several important parameters, including processing conditions, package geometry and materials, are specifically studied on the occurrence of warpage and coplanarity for a plastic package. Special emphasis is placed on the evaluation of moulding compound properties and optimal processing conditions that can effectively minimize warpage. It is found that moulding compounds requiring a low moulding temperature and having a low coefficient of thermal expansion (CTE) can significantly reduce warpage. The elastic modulus was found to be inversely proportional to warpage, indicating the modulus should be kept as high as possible. The post-mould curing is essential to reducing warpage as it increases the glass transition temperature, but lowers the thermal shrinkage. A cross-shaped die paddle against a full square paddle, a thick die attach and a large die size are also favorable to reducing warpage.

KW - Coplanarity

KW - Cross-shaped die paddle

KW - CTE

KW - Full square paddle

KW - Glass transition temperature

KW - Modulus

KW - Moulding compounds

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KW - Post-mould curing

KW - Thermal shrinkage

KW - Warpage

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JO - IEEE Transactions on Electronics Packaging Manufacturing

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Warpage in plastic packages: Effects of process conditions, geometry and materials

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