Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

Ariya Sangwongwanich, Huai Wang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.

    Original languageBritish English
    Title of host publication2020 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    ISBN (Electronic)9789075815368
    DOIs
    StatePublished - Sep 2020
    Event22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe - Lyon, France
    Duration: 7 Sep 202011 Sep 2020

    Publication series

    Name2020 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe

    Conference

    Conference22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe
    Country/TerritoryFrance
    CityLyon
    Period7/09/2011/09/20

    Keywords

    • Mission profile
    • Photovoltaic
    • Power semiconductor device
    • Reliability
    • Thermal stress

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