Two-phase flow instability analysis for transient electronics cooling

Tie Jun Zhang, Yoav Peles, John T. Wen, Michael K. Jensen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Because of increasing power densities, refrigeration systems are being explored for two-phase cooling of ultra high power electronic components. This paper presents a framework for the transient analysis of pressure-drop refrigerant flow instabilities under both steady-state and transient imposed heat loads. Based on an analytical two-phase flow model, the system pressure and other effects on flow characteristics are quantitatively studied, so as to predict the associated flow instability margin. The most significant effect on electronics cooling system dynamics is the imposed heat load. One of the main research topics here is to study the boiling oscillatory flow responses to transient heat load changes, which can reflect the transient two-phase cooling capacity. Furthermore, the effect of wall thermal inertia on flow oscillation is systematically studied. Application-based pulsed heat load scenarios are finally evaluated. This transient instability analysis offers useful insight for future active thermal management system design.

Original languageBritish English
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
StatePublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV, United States
Duration: 2 Jun 20105 Jun 2010

Publication series

Name2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Conference

Conference2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Country/TerritoryUnited States
CityLas Vegas, NV
Period2/06/105/06/10

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