@inproceedings{92f4b0d659a44bad93a3df2fb1c3d924,
title = "Two-phase flow instability analysis for transient electronics cooling",
abstract = "Because of increasing power densities, refrigeration systems are being explored for two-phase cooling of ultra high power electronic components. This paper presents a framework for the transient analysis of pressure-drop refrigerant flow instabilities under both steady-state and transient imposed heat loads. Based on an analytical two-phase flow model, the system pressure and other effects on flow characteristics are quantitatively studied, so as to predict the associated flow instability margin. The most significant effect on electronics cooling system dynamics is the imposed heat load. One of the main research topics here is to study the boiling oscillatory flow responses to transient heat load changes, which can reflect the transient two-phase cooling capacity. Furthermore, the effect of wall thermal inertia on flow oscillation is systematically studied. Application-based pulsed heat load scenarios are finally evaluated. This transient instability analysis offers useful insight for future active thermal management system design.",
author = "Zhang, {Tie Jun} and Yoav Peles and Wen, {John T.} and Jensen, {Michael K.}",
year = "2010",
doi = "10.1109/ITHERM.2010.5501386",
language = "British English",
isbn = "9781424453429",
series = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
note = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 ; Conference date: 02-06-2010 Through 05-06-2010",
}