Two-dimensional thermal modeling and parametric optimization of printed circuit board vias

Yanfeng Shen, Hui Zhao, Teng Long, Huai Wang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    5 Scopus citations

    Abstract

    This paper proposes an analytical thermal resistance model for printed circuit board (PCB) vias considering both the vertical- and radial-directional heat transfers. A lumped two-dimensional (2D) thermal resistance network is developed, and a numerical algorithm is proposed to simplify this network. Based on this proposed thermal model, the impacts of different design parameters on the equivalent thermal resistances of the PCB vias are easily investigated, yielding design guidelines for PCB vias. Finally, computational fluid dynamics (CFD) simulation results validate the developed 2D thermal model.

    Original languageBritish English
    Title of host publication2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages4931-4936
    Number of pages6
    ISBN (Electronic)9781728103952
    DOIs
    StatePublished - Sep 2019
    Event11th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2019 - Baltimore, United States
    Duration: 29 Sep 20193 Oct 2019

    Publication series

    Name2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019

    Conference

    Conference11th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2019
    Country/TerritoryUnited States
    CityBaltimore
    Period29/09/193/10/19

    Keywords

    • Printed circuit board (PCB)
    • Thermal resistance
    • Thermal vias
    • Two-dimensional heat transfer

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