Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags

Zhijian Yin, Yongheng Yang, Huai Wang

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    4 Scopus citations

    Abstract

    The trend for the model-based design of modular multilevel converters (MMC) demands a better estimation of the submodule (SM) voltage stress. The transient voltage stresses of MMC SMs are important for the SM capacitor dimensioning and the robustness of power modules. This paper proposes an analytical model of the SM transient voltage stress under grid voltage sags. It is based on a simplified analysis of the MMC current control and circulating current control schemes. A case study reveals that a sufficient accuracy level can be achieved with the proposed model to estimate the transient voltage stress.

    Original languageBritish English
    Title of host publication2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1021-1026
    Number of pages6
    ISBN (Electronic)9784886864055
    DOIs
    StatePublished - 22 Oct 2018
    Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
    Duration: 20 May 201824 May 2018

    Publication series

    Name2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

    Conference

    Conference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
    Country/TerritoryJapan
    CityNiigata
    Period20/05/1824/05/18

    Keywords

    • dynamic analysis
    • grid voltage sag
    • modular multilevel converter
    • Submodulue voltage stress

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