Tracking microparticles subjected to dielectrophoresis in a continuous flow microdevice

Bobby Mathew, Anas Alazzam, Bashar S. El-Khasawneh, Saud A. Khashan, Ghulam Destgeer, Hyung J. Sung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This article details the development of a two-dimensional model for tracking microparticles subjected to dielectrophoresis in a continuous flow microdevice. The electric field is generated by interdigitated transducer electrodes placed on the bottom of the microchannel. The motion of the microparticles and the electric potential inside the microchannel are described using Newton's 2nd law and Laplace equation, respectively. The governing equations are solved using finite difference method. The model accounts for forces such as inertia, drag and dielectrophoresis. The model is used for parametric study in this article; the parameters considered include microparticle radii, actuation voltage, microchannel height and volumetric flow rate. From the parametric study it is observed that the trajectory of microparticles depends on all these parameters though only the actuation voltage, among these parameters, influences the steady state levitation height.

Original languageBritish English
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
ISBN (Electronic)9780791857533
DOIs
StatePublished - 2015
EventASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015 - Houston, United States
Duration: 13 Nov 201519 Nov 2015

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10-2015

Conference

ConferenceASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015
Country/TerritoryUnited States
CityHouston
Period13/11/1519/11/15

Fingerprint

Dive into the research topics of 'Tracking microparticles subjected to dielectrophoresis in a continuous flow microdevice'. Together they form a unique fingerprint.

Cite this