Three-dimensional packaging for multi-chip module with through-the-silicon via hole
- Y. K. Tsui
- , S. W.R. Lee
- , J. S. Wu
- , J. K. Kim
- , M. M.F. Yuen
- The Hong Kong University of Science and Technology
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
19
Scopus
citations