Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint

Dive into the research topics of 'Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys'. Together they form a unique fingerprint.

Engineering

Material Science