TY - JOUR
T1 - Thermal performance of flip chip packages
T2 - Numerical study of thermo-mechanical interactions
AU - Sham, Man Lung
AU - Kim, Jang Kyo
AU - Park, Joo Hyuk
N1 - Funding Information:
The work described in this paper was partially supported by grants from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project No. HKUST 6014/98E and DAG 00/01. EG18). Technical supports from the Materials Characterization and Preparation Facilities (MCPF) and EPack Laboratory of HKUST are appreciated. Part of the numerical analysis was performed when the first author (MLS) was a visiting scholar at Sejong University, Korea in 2002.
PY - 2008/9
Y1 - 2008/9
N2 - Excessive heat and temperature gradient may introduce failures in the components, such as cracking, delamination and warpage, eventually causing device failure. While there has been significant research toward understanding the thermal performance of many different electronic packages, the majority of these studies do not take into account the combined effects of thermal and mechanical interactions. This paper evaluates the thermal performance of flip chip packages based on the couple-field elements available in a numerical code, ANSYS, to study the interactions between temperature and stresses generated during the manufacturing process, where both two dimensional (2D) plane strain and three dimensional (3D) models of the flip chip package are considered. Compared with the model assuming uniform temperature distribution over the entire package, the model with temperature gradient provided more accurate stress profiles in the solder interconnections and underfill fillet. Further finite element studies based on the 2D model are conducted to evaluate the effects of thermal conductivity and substrate board configuration on the overall temperature and stress distribution in the package.
AB - Excessive heat and temperature gradient may introduce failures in the components, such as cracking, delamination and warpage, eventually causing device failure. While there has been significant research toward understanding the thermal performance of many different electronic packages, the majority of these studies do not take into account the combined effects of thermal and mechanical interactions. This paper evaluates the thermal performance of flip chip packages based on the couple-field elements available in a numerical code, ANSYS, to study the interactions between temperature and stresses generated during the manufacturing process, where both two dimensional (2D) plane strain and three dimensional (3D) models of the flip chip package are considered. Compared with the model assuming uniform temperature distribution over the entire package, the model with temperature gradient provided more accurate stress profiles in the solder interconnections and underfill fillet. Further finite element studies based on the 2D model are conducted to evaluate the effects of thermal conductivity and substrate board configuration on the overall temperature and stress distribution in the package.
KW - Couple-field element
KW - Finite element analysis
KW - Flip chip package
KW - Thermal-mechanical analysis
UR - http://www.scopus.com/inward/record.url?scp=49349092303&partnerID=8YFLogxK
U2 - 10.1016/j.commatsci.2007.12.008
DO - 10.1016/j.commatsci.2007.12.008
M3 - Article
AN - SCOPUS:49349092303
SN - 0927-0256
VL - 43
SP - 469
EP - 480
JO - Computational Materials Science
JF - Computational Materials Science
IS - 3
ER -