Thermal Modeling and Sizing of PCB Copper Pads

Yanfeng Shen, Huai Wang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    In low power applications, a surface mounted device (SMD) is naturally cooled by attaching to a printed circuit board (PCB) copper pad. This paper proposes an analytical thermal resistance model and a sizing algorithm for PCB copper pads. Firstly, an axisymmetric thermal resistance model is developed for PCB copper pads where the heat conduction, convection and radiation all exist. Due to the interdependence of the conductive/radiative heat transfer coefficient and the board temperature, a new algorithm is proposed to fast obtain the thermal resistance and to predict the semiconductor junction temperature at different copper pad radii. The algorithm enables a fast sizing of copper pads based on different junction temperature limits. Finally, the developed thermal resistance model and algorithm are verified by computational fluid dynamics (CFD) simulations and experiments.

    Original languageBritish English
    Title of host publication2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages5087-5093
    Number of pages7
    ISBN (Electronic)9781479973118
    DOIs
    StatePublished - 3 Dec 2018
    Event10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018 - Portland, United States
    Duration: 23 Sep 201827 Sep 2018

    Publication series

    Name2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

    Conference

    Conference10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018
    Country/TerritoryUnited States
    CityPortland
    Period23/09/1827/09/18

    Keywords

    • Copper pad
    • Printed circuit board (PCB)
    • Thermal resistance model

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