Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface

G. Q. Zhang; L. J. Ernst; P. Rodgers; S. Marco; M. Meuwissen; O. De Saint Leger

doi:10.1109/ESIME.2005.1502753

Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface

G. Q. Zhang
, L. J. Ernst
, P. Rodgers
, S. Marco
, M. Meuwissen
, O. De Saint Leger

Research output: Contribution to journal › Editorial

Original language	British English
Article number	1502753
Pages (from-to)	v
Journal	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Volume	2005
DOIs	https://doi.org/10.1109/ESIME.2005.1502753
State	Published - 2005
Event	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 - Berlin, Germany Duration: 18 Apr 2005 → 20 Apr 2005

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10.1109/ESIME.2005.1502753

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Zhang, G. Q., Ernst, L. J., Rodgers, P., Marco, S., Meuwissen, M., & De Saint Leger, O. (2005). Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, 2005, v. Article 1502753. https://doi.org/10.1109/ESIME.2005.1502753

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Zhang, GQ, Ernst, LJ, Rodgers, P, Marco, S, Meuwissen, M & De Saint Leger, O 2005, 'Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface', Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, vol. 2005, 1502753, pp. v. https://doi.org/10.1109/ESIME.2005.1502753

Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface. / Zhang, G. Q.; Ernst, L. J.; Rodgers, P. et al.
In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, Vol. 2005, 1502753, 2005, p. v.

Research output: Contribution to journal › Editorial

TY - JOUR

T1 - Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System

T2 - 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

AU - Zhang, G. Q.

AU - Ernst, L. J.

AU - Rodgers, P.

AU - Marco, S.

AU - Meuwissen, M.

AU - De Saint Leger, O.

PY - 2005

Y1 - 2005

UR - https://www.scopus.com/pages/publications/33745698168

U2 - 10.1109/ESIME.2005.1502753

DO - 10.1109/ESIME.2005.1502753

M3 - Editorial

AN - SCOPUS:33745698168

VL - 2005

SP - v

JO - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

JF - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

M1 - 1502753

Y2 - 18 April 2005 through 20 April 2005

ER -

Zhang GQ, Ernst LJ, Rodgers P, Marco S, Meuwissen M, De Saint Leger O. Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005;2005:v. 1502753. doi: 10.1109/ESIME.2005.1502753

Thermal, Mechanical and Multi-Physics Simulation and Experiment in Micro-Electronics and Micro-System: Preface

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