Thermal Coupling and Network Modeling for Planar Transformers

Zhan Shen, Yanfeng Shen, Bochen Liu, Huai Wang

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    8 Scopus citations

    Abstract

    With the application of wide band gap devices in power electronics, planar transformers are preferred to further reduce the profile and manufacture cost. As a critical factor affecting the reliability, the temperature of the planar transformer is unevenly distributed and should be considered in the design phase. In this regard, a detailed thermal model enabling the temperature prediction for both the core and windings is imperative. In this paper, a thermal impedance network of the planar core is proposed considering the thermal coupling of the ambient, the core and the printed circuit board (PCB) windings. With the time-efficient computational fluid dynamics (CFD) simulation, the parameters of the network are extracted and the matrix-based model is obtained. Moreover, the model can be well coupled with the electric circuit model to perform the multi-physics optimization and simulation of the planar transformer. Finally, the proposed model is verified by both simulation and experiment results on a MHz prototype.

    Original languageBritish English
    Title of host publication2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages3527-3533
    Number of pages7
    ISBN (Electronic)9781479973118
    DOIs
    StatePublished - 3 Dec 2018
    Event10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018 - Portland, United States
    Duration: 23 Sep 201827 Sep 2018

    Publication series

    Name2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

    Conference

    Conference10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018
    Country/TerritoryUnited States
    CityPortland
    Period23/09/1827/09/18

    Keywords

    • Planar transformer
    • Power losses
    • Thermal model
    • Thermal network

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