Thermal and mechanical performance assessment of two commercially-available PA66 polymer composite materials for microelectronics heat exchanger applications

  • Ismail Darawsheh
  • , Antoine Diana
  • , Peter Rodgers
  • , Valerie Eveloy
  • , Fahad Al Maskari
  • , Shirinivas Bojanampati

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Two commercially-available thermally-enhanced polyamide 66 (PA66) polymer composite materials having thermal conductivities of 20 to 30 W/m.K, sourced from two different vendors, are experimentally characterized in terms of thermal performance and mechanical properties. The heat transfer rates of prototype air-water heat exchangers made from both PA66 materials are found to be comparable to that of an aluminum exchanger having the same geometry, demonstrating the potential feasibility of replacing conventional metallic heat exchangers with thermally enhanced polymeric composite heat exchangers in microelectronic airliquid cooling applications. However, significant differences are found in the measured mechanical properties of the two PA66 composite materials, namely tensile, flexural and impact strengths, which are attributable to fiber geometry and composition.

Original languageBritish English
Title of host publication2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509021062
DOIs
StatePublished - 29 Apr 2016
Event17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, France
Duration: 18 Apr 201620 Apr 2016

Publication series

Name2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016

Conference

Conference17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Country/TerritoryFrance
CityMontpellier
Period18/04/1620/04/16

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