The impact of mission profile models on the predicted lifetime of IGBT modules in the modular multilevel converter

Yi Zhang, Huai Wang, Zhongxu Wang, Yongheng Yang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    26 Scopus citations

    Abstract

    The reliability aspect study of Modular Multilevel Converter (MMC) is of great interest in industry applications, such as offshore wind. Lifetime prediction of key components is an important tool to design MMC with fulfilled reliability specifications. While many efforts have been made to the lifetime prediction of IGBT modules in renewable energy applications by considering long-term varying operation conditions (i.e., mission profile), the justifications of using the associated mission profiles are still missed. This paper investigates the impact of mission profile data resolutions and electrical power modeling methods on the estimated lifetime of IGBT modules in an MMC for offshore wind power application. In a 30 MW MMC case study, an annual wind speed profile with a resolution of 1 s/data, 10 minute/data, and 1 hour/data are considered, respectively. A method to re-generate higher resolution wind speed data from lower resolution data is introduced as well. Based on the wind speed data, IEC 61400-12-1 power curve model and a wind speed-power stochastic model are compared as well. Five mission profile modeling scenarios are compared in terms of the predicted lifetime of the IGBT modules used in the MMC, resulting in significant differences. The study serves as a first step to quantify the impact of mission profile modeling on lifetime prediction, and to provide a guideline on mission profile collection for the presented application.

    Original languageBritish English
    Title of host publicationProceedings IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages7980-7985
    Number of pages6
    ISBN (Electronic)9781538611272
    DOIs
    StatePublished - 15 Dec 2017
    Event43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, China
    Duration: 29 Oct 20171 Nov 2017

    Publication series

    NameProceedings IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society
    Volume2017-January

    Conference

    Conference43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
    Country/TerritoryChina
    CityBeijing
    Period29/10/171/11/17

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