Ten years of thermal analysis at eurosime - What's next?

Peter Rodgers; Valerie Eveloy

doi:10.1109/ESIME.2009.4938509

Ten years of thermal analysis at eurosime - What's next?

Peter Rodgers
, Valerie Eveloy

Mechanical & Nuclear Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper presents an overview of thermal analyses of micro-electronics and micro-systems presented in the thermal analysis Track at EuroSimEsince the inception of the conference in 2000. This overview is based on a bibliography of approximately140 papers compiled in this paper. The achievements of the conference in producing an archival record in the field of micro-electronics and micro-systems thermal analysis are summarized, in terms of numerical analysis versus experimental characterization, coupling of thermal analyses with other physics, thermal management strategies, microelectronics packaging technologies, and sustainability of thermal designs. How this work has served as a building block for thermo-mechanical and multi-physics analyses presented at the conference is outlined. Finally, critical areas of thermal analysis that need to be addressed by EuroSimE in the foreseeable future are identified.

Original language	British English
Title of host publication	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs	https://doi.org/10.1109/ESIME.2009.4938509
State	Published - 2009
Event	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009

Publication series

Name	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Conference

Conference	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	26/04/09 → 29/04/09

Access to Document

10.1109/ESIME.2009.4938509

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Cite this

Rodgers, P., & Eveloy, V. (2009). Ten years of thermal analysis at eurosime - What's next? In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 Article 4938509 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). https://doi.org/10.1109/ESIME.2009.4938509

Rodgers, Peter ; Eveloy, Valerie. / Ten years of thermal analysis at eurosime - What's next?. 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

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title = "Ten years of thermal analysis at eurosime - What's next?",

abstract = "This paper presents an overview of thermal analyses of micro-electronics and micro-systems presented in the thermal analysis Track at EuroSimEsince the inception of the conference in 2000. This overview is based on a bibliography of approximately140 papers compiled in this paper. The achievements of the conference in producing an archival record in the field of micro-electronics and micro-systems thermal analysis are summarized, in terms of numerical analysis versus experimental characterization, coupling of thermal analyses with other physics, thermal management strategies, microelectronics packaging technologies, and sustainability of thermal designs. How this work has served as a building block for thermo-mechanical and multi-physics analyses presented at the conference is outlined. Finally, critical areas of thermal analysis that need to be addressed by EuroSimE in the foreseeable future are identified.",

author = "Peter Rodgers and Valerie Eveloy",

year = "2009",

doi = "10.1109/ESIME.2009.4938509",

language = "British English",

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series = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

booktitle = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

note = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 ; Conference date: 26-04-2009 Through 29-04-2009",

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Rodgers, P & Eveloy, V 2009, Ten years of thermal analysis at eurosime - What's next? in 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009., 4938509, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, Delft, Netherlands, 26/04/09. https://doi.org/10.1109/ESIME.2009.4938509

Ten years of thermal analysis at eurosime - What's next? / Rodgers, Peter; Eveloy, Valerie.
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938509 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review