Ten years of thermal analysis at eurosime - What's next?

Peter Rodgers, Valerie Eveloy

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents an overview of thermal analyses of micro-electronics and micro-systems presented in the thermal analysis Track at EuroSimEsince the inception of the conference in 2000. This overview is based on a bibliography of approximately140 papers compiled in this paper. The achievements of the conference in producing an archival record in the field of micro-electronics and micro-systems thermal analysis are summarized, in terms of numerical analysis versus experimental characterization, coupling of thermal analyses with other physics, thermal management strategies, microelectronics packaging technologies, and sustainability of thermal designs. How this work has served as a building block for thermo-mechanical and multi-physics analyses presented at the conference is outlined. Finally, critical areas of thermal analysis that need to be addressed by EuroSimE in the foreseeable future are identified.

Original languageBritish English
Title of host publication2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs
StatePublished - 2009
Event2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands
Duration: 26 Apr 200929 Apr 2009

Publication series

Name2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Conference

Conference2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/TerritoryNetherlands
CityDelft
Period26/04/0929/04/09

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