TE-pass polarizer using metal vias for silicon-on-insulator platform

Humaira Zafar, Soha E. Yousuf, Anatol Khilo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A TE-pass polarizer that uses metal vias for absorption of TM light is proposed. A 100-micron device can achieve 20dB extinction ratio with 0.23dB insertion loss. The polarizer is compatible with standard silicon-on-insulator foundry processes.

Original languageBritish English
Title of host publication2015 Opto-Electronics and Communications Conference, OECC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467379441
DOIs
StatePublished - 30 Nov 2015
EventOpto-Electronics and Communications Conference, OECC 2015 - Shanghai, China
Duration: 28 Jun 20152 Jul 2015

Publication series

Name2015 Opto-Electronics and Communications Conference, OECC 2015

Conference

ConferenceOpto-Electronics and Communications Conference, OECC 2015
Country/TerritoryChina
CityShanghai
Period28/06/152/07/15

Keywords

  • polarizer
  • silicon photonics
  • TE
  • TM
  • via

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