Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications

Subramani Devaraju; Muthukumaraswamy Rangaraj Vengatesan; Mohan Selvi; Achimuthu Ashok Kumar; Mutukaruppan Alagar

doi:10.1177/0954008311433606

Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications

Subramani Devaraju, Muthukumaraswamy Rangaraj Vengatesan, Mohan Selvi, Achimuthu Ashok Kumar, Mutukaruppan Alagar

Research output: Contribution to journal › Article › peer-review

63 Scopus citations

Abstract

Polyhedral oligomeric silsesquioxane (POSS)-polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (Tg), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.

Original language	British English
Pages (from-to)	85-96
Number of pages	12
Journal	High Performance Polymers
Volume	24
Issue number	2
DOIs	https://doi.org/10.1177/0954008311433606
State	Published - Mar 2012

Keywords

dielectric constant
flame-retardant
glass transition temperature
polyhedral oligomeric silsesquioxane
polyimide
thermal stability

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10.1177/0954008311433606

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@article{c4c2732efe7948d989fe9fe171c00a4d,

title = "Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications",

abstract = "Polyhedral oligomeric silsesquioxane (POSS)-polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (Tg), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.",

keywords = "dielectric constant, flame-retardant, glass transition temperature, polyhedral oligomeric silsesquioxane, polyimide, thermal stability",

author = "Subramani Devaraju and Vengatesan, {Muthukumaraswamy Rangaraj} and Mohan Selvi and Kumar, {Achimuthu Ashok} and Mutukaruppan Alagar",

note = "Funding Information: The authors thank DST (Nanomission),SR/NM/NS-18/2010, New Delhi, Government of India, for the financial support and the Department of Mechanical Engineering, Anna University, for providing the scanning electron microscopy analysis facility. The authors also acknowledge M. Vinoba, A. Chandramohan, C. Truppati Raja, K.V.Thiruvengadaravi and Miss M. Mandhakini, research scholars, Polymer Composite Lab, Department of Chemical Engineering, Anna University.",

year = "2012",

month = mar,

doi = "10.1177/0954008311433606",

language = "British English",

volume = "24",

pages = "85--96",

journal = "High Performance Polymers",

issn = "0954-0083",

publisher = "SAGE Publications Ltd",

number = "2",

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TY - JOUR

T1 - Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications

AU - Devaraju, Subramani

AU - Vengatesan, Muthukumaraswamy Rangaraj

AU - Selvi, Mohan

AU - Kumar, Achimuthu Ashok

AU - Alagar, Mutukaruppan

N1 - Funding Information: The authors thank DST (Nanomission),SR/NM/NS-18/2010, New Delhi, Government of India, for the financial support and the Department of Mechanical Engineering, Anna University, for providing the scanning electron microscopy analysis facility. The authors also acknowledge M. Vinoba, A. Chandramohan, C. Truppati Raja, K.V.Thiruvengadaravi and Miss M. Mandhakini, research scholars, Polymer Composite Lab, Department of Chemical Engineering, Anna University.

PY - 2012/3

Y1 - 2012/3

N2 - Polyhedral oligomeric silsesquioxane (POSS)-polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (Tg), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.

AB - Polyhedral oligomeric silsesquioxane (POSS)-polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (Tg), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.

KW - dielectric constant

KW - flame-retardant

KW - glass transition temperature

KW - polyhedral oligomeric silsesquioxane

KW - polyimide

KW - thermal stability

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U2 - 10.1177/0954008311433606

DO - 10.1177/0954008311433606

M3 - Article

AN - SCOPUS:84859909347

SN - 0954-0083

VL - 24

SP - 85

EP - 96

JO - High Performance Polymers

JF - High Performance Polymers

IS - 2

ER -

Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications

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Keywords

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