TY - JOUR
T1 - Simulation of conventional bipolar logic technologies in 4H-SiC for harsh environment applications
AU - Elgabra, Hazem
AU - Siddiqui, Amna
AU - Singh, Shakti
N1 - Funding Information:
This work is supported by Mubadala and the Semiconductor Research Corporation (SRC) contract number 2011-HJ-2187.
Publisher Copyright:
© 2016 The Japan Society of Applied Physics.
PY - 2016/4
Y1 - 2016/4
N2 - Silicon carbide (SiC) is a wide bandgap semiconductor that is inherently capable of operation in unforgiving environments such as high temperatures and radiation. Currently, the control circuitry for SiC based power devices and sensors are silicon based, limiting the overall efficiency of the system in such environments. 4H-SiC integrated circuits, based on different conventional logic technologies, have been investigated in the past using different device structures, by various research groups. This paper presents a thorough investigation of conventional bipolar logic technologies in 4H-SiC simulated across a wide range of temperatures (300-773 K) and power supply voltages (7-17 V). Unlike previous studies, this paper evaluates different technologies using the same device structure in the simulation, to highlight the true merits of each logic technology. The stable performance of all the studied logic technologies in SiC validates the potential of 4H-SiC ICs in small scale logic applications.
AB - Silicon carbide (SiC) is a wide bandgap semiconductor that is inherently capable of operation in unforgiving environments such as high temperatures and radiation. Currently, the control circuitry for SiC based power devices and sensors are silicon based, limiting the overall efficiency of the system in such environments. 4H-SiC integrated circuits, based on different conventional logic technologies, have been investigated in the past using different device structures, by various research groups. This paper presents a thorough investigation of conventional bipolar logic technologies in 4H-SiC simulated across a wide range of temperatures (300-773 K) and power supply voltages (7-17 V). Unlike previous studies, this paper evaluates different technologies using the same device structure in the simulation, to highlight the true merits of each logic technology. The stable performance of all the studied logic technologies in SiC validates the potential of 4H-SiC ICs in small scale logic applications.
UR - http://www.scopus.com/inward/record.url?scp=84963690678&partnerID=8YFLogxK
U2 - 10.7567/JJAP.55.04ER08
DO - 10.7567/JJAP.55.04ER08
M3 - Article
AN - SCOPUS:84963690678
SN - 0021-4922
VL - 55
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 4
M1 - 04ER08
ER -