Simplified multi-time scale thermal model considering thermal coupling in IGBT modules

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    20 Scopus citations

    Abstract

    In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano-or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.

    Original languageBritish English
    Title of host publication34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages319-324
    Number of pages6
    ISBN (Electronic)9781538683309
    DOIs
    StatePublished - 24 May 2019
    Event34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States
    Duration: 17 Mar 201921 Mar 2019

    Publication series

    NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
    Volume2019-March

    Conference

    Conference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
    Country/TerritoryUnited States
    CityAnaheim
    Period17/03/1921/03/19

    Keywords

    • Power semiconductor
    • Reliability
    • Thermal coupling
    • Thermal modeling

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