Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

    Original languageBritish English
    Title of host publication2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages6830-6837
    Number of pages8
    ISBN (Electronic)9781479973118
    DOIs
    StatePublished - 3 Dec 2018
    Event10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018 - Portland, United States
    Duration: 23 Sep 201827 Sep 2018

    Publication series

    Name2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

    Conference

    Conference10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018
    Country/TerritoryUnited States
    CityPortland
    Period23/09/1827/09/18

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