Resistive switching in sol-gel derived microscale memristors

This paper describes the synthesis of micro-Thick hafnium-oxide (60 μm) memristors using a low-cost sol-gel drop-coating technique, and emphasizes on key parameters to be considered in the development of the microscale technology. The impact of electrode material on the device I-V electrical behavior is screened with the use of different metals, with different work-functions and oxygen affinities such as aluminum (Al), copper (Cu), titanium (Ti) and palladium (Pd) under a symmetric metal-insulator-metal arrangement. The type of metal contact was found to play a vital role in the switching behavior of the devices, highlighting a potential chemical interplay between the drop-coating solution and the electrode surface during the fabrication process. The effect of the sol-gel drying temperature on the I-V curve characteristics is also investigated with similar devices made at 60 °C and 80 °C. For example, the ROFF/RON ratio of Al/Al-Type memristors was found to increase by approximately nine folds when the drying temperature was increased from 60 °C to 80 °C. As depicted from the changes observed in the maximum flowing current within an I-V curve, the drying temperature was generally found to mainly affect the internal resistance of the devices, allowing external control over the ROFF/RON ratio.