Preface

Research output: Chapter in Book/Report/Conference proceeding › Foreword/postscript

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Original language	British English
Title of host publication	3D Stacked Chips
Subtitle of host publication	From Emerging Processes to Heterogeneous Systems
Pages	xi-xv
ISBN (Electronic)	9783319204819
DOIs	https://doi.org/10.1007/978-3-319-20481-9
State	Published - 1 Jan 2016

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