Prediction of thin liquid film evaporation characteristics with a thermal lattice boltzmann method

Weilin Yang, Hongxia Li, Mohamed H. Alhosani, Tiejun Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Evaporation plays an important role in many industrial applications, such as power generation, cooling, and thermal management. Micro/nanostructured surfaces have the potential of enhancing evaporation heat transfer, but its heat and mass transport mechanism becomes more complicated because of the surface wettability and capillarity effects. It is imperative to understand the evaporation mechanism of thin liquid film for heat transfer enhancement. Effective evaporation occurs in the thin liquid film region, instead of in the adsorbed ultrathin film region or intrinsic meniscus region. Although some theoretical and experimental results have been reported, detailed thin film evaporation (TFE) physics, especially heat and mass transport at the liquid-vapor interface, is still unclear. In this paper, we provide a mesoscopic lattice Boltzmann method (LBM) to study the TFE problems under various heating scenarios. In our study, a thermal LBM approach is used to simulate TFE and predict some macroscopic properties. Our thermal LBM simulations agree well with the reported experimental data and theoretical results, which empowers our model to probe the interfacial TFE physics and design high-performance micro/nano engineered evaporators.

Original languageBritish English
Title of host publicationProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1240-1247
Number of pages8
ISBN (Electronic)9781467381215
DOIs
StatePublished - 20 Jul 2016
Event15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States
Duration: 31 May 20163 Jun 2016

Publication series

NameProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

Conference

Conference15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
Country/TerritoryUnited States
CityLas Vegas
Period31/05/163/06/16

Keywords

  • Thermal lattice Boltzmann method
  • Thin film evaporation

Fingerprint

Dive into the research topics of 'Prediction of thin liquid film evaporation characteristics with a thermal lattice boltzmann method'. Together they form a unique fingerprint.

Cite this