Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

Aharon Nabi; Peter Rodgers; Avram Bar-Cohen

Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

Aharon Nabi, Peter Rodgers, Avram Bar-Cohen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

10 Scopus citations

Abstract

The fouling of air-cooled fine-pitch heat sinks by air born dust particles has become a major reliability concern for desktop and notebook personal computers, where significant thermal performance degradation can result. This paper investigates for the first time heat sink fouling mechanisms by both analytical and experimental analyses. The contribution of two fouling modes, namely accumulation of a thermally insulative dust coating on the fins within the heat sink channels, and blockage of the heat sink leading edge entrance, is quantified. It is found that the former fouling mode does not significantly increase heat sink thermal resistance. Instead, heat sink thermal performance degradation is essentially attributable to leading edge entrance blockage, which reduces the airflow rate through the heat sink by increasing pressure drop.

Original language	British English
Title of host publication	Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006
Pages	2-9
Number of pages	8
State	Published - 2006
Event	22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006 - Dallas, TX, United States Duration: 14 Mar 2006 → 16 Mar 2006

Publication series

Name	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume	2006
ISSN (Print)	1065-2221

Conference

Conference	22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006
Country/Territory	United States
City	Dallas, TX
Period	14/03/06 → 16/03/06

Keywords

Air cooling
Dust
Fouling
Heat sink
Leading edge blockage
Thermal characterization
Thermal resistance

Cite this

Nabi, A., Rodgers, P., & Bar-Cohen, A. (2006). Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling. In Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006 (pp. 2-9). Article 1625198 (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; Vol. 2006).

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title = "Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling",

abstract = "The fouling of air-cooled fine-pitch heat sinks by air born dust particles has become a major reliability concern for desktop and notebook personal computers, where significant thermal performance degradation can result. This paper investigates for the first time heat sink fouling mechanisms by both analytical and experimental analyses. The contribution of two fouling modes, namely accumulation of a thermally insulative dust coating on the fins within the heat sink channels, and blockage of the heat sink leading edge entrance, is quantified. It is found that the former fouling mode does not significantly increase heat sink thermal resistance. Instead, heat sink thermal performance degradation is essentially attributable to leading edge entrance blockage, which reduces the airflow rate through the heat sink by increasing pressure drop.",

keywords = "Air cooling, Dust, Fouling, Heat sink, Leading edge blockage, Thermal characterization, Thermal resistance",

author = "Aharon Nabi and Peter Rodgers and Avram Bar-Cohen",

year = "2006",

language = "British English",

isbn = "1424401534",

series = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

pages = "2--9",

booktitle = "Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006",

note = "22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006 ; Conference date: 14-03-2006 Through 16-03-2006",

}

Nabi, A, Rodgers, P & Bar-Cohen, A 2006, Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling. in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006., 1625198, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, vol. 2006, pp. 2-9, 22nd Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 2006, Dallas, TX, United States, 14/03/06.

Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling. / Nabi, Aharon; Rodgers, Peter; Bar-Cohen, Avram.
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006. 2006. p. 2-9 1625198 (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; Vol. 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Y1 - 2006

N2 - The fouling of air-cooled fine-pitch heat sinks by air born dust particles has become a major reliability concern for desktop and notebook personal computers, where significant thermal performance degradation can result. This paper investigates for the first time heat sink fouling mechanisms by both analytical and experimental analyses. The contribution of two fouling modes, namely accumulation of a thermally insulative dust coating on the fins within the heat sink channels, and blockage of the heat sink leading edge entrance, is quantified. It is found that the former fouling mode does not significantly increase heat sink thermal resistance. Instead, heat sink thermal performance degradation is essentially attributable to leading edge entrance blockage, which reduces the airflow rate through the heat sink by increasing pressure drop.

AB - The fouling of air-cooled fine-pitch heat sinks by air born dust particles has become a major reliability concern for desktop and notebook personal computers, where significant thermal performance degradation can result. This paper investigates for the first time heat sink fouling mechanisms by both analytical and experimental analyses. The contribution of two fouling modes, namely accumulation of a thermally insulative dust coating on the fins within the heat sink channels, and blockage of the heat sink leading edge entrance, is quantified. It is found that the former fouling mode does not significantly increase heat sink thermal resistance. Instead, heat sink thermal performance degradation is essentially attributable to leading edge entrance blockage, which reduces the airflow rate through the heat sink by increasing pressure drop.

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KW - Dust

KW - Fouling

KW - Heat sink

KW - Leading edge blockage

KW - Thermal characterization

KW - Thermal resistance

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Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling

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Keywords

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