TY - JOUR
T1 - Organoclay-filled vinyl ester monomer toughened epoxy-intercrosslinked matrix materials
AU - Chandramohan, A.
AU - Vengatesan, M. R.
AU - Devaraju, S.
AU - Dinakaran, K.
AU - Alagar, M.
N1 - Funding Information:
The authors acknowledge the financial support for this work by the University Grants Commission (UGC), Government of India. The authors also thank Dr. P. Gnanasundaram, Dr. K. V. Thiruvengadaravi, and Dr. P. Baskaralingam, Department of Chemical Engineering, Alagappa College of Technology, Anna University, Chennai, for their support of this work.
PY - 2013/3/1
Y1 - 2013/3/1
N2 - A vinyl ester monomer (VEM), namely cyclohexyl-1,1′-bis[4-(γ-2- methylphenoxy)-hydroxypropylacrylate], was synthesized from 1, 1-bis (3-methyl-4-glycidyloxyphenyl) cyclohexane, and acrylic acid via nucleophilic addition. The structure of VEM was confirmed by FTIR, 1H, 13C NMR, and electron impact-mass spectroscopy. Diglycidyl ethers of bisphenol-A (DGEBA) epoxy resin were toughened with varying percentages of 5, 10, and 15% (by wt) VEM using 4, 4′-diaminodiphenylmethane (DDM). VEM-modified epoxy systems were further modified with organophilic montmorillonite (OMMT) clay. OMMT clay-filled hybrid VEM-epoxy resin systems, developed in the form of casting, were characterized for their mechanical, thermomechanical, dielectric, and morphological properties.
AB - A vinyl ester monomer (VEM), namely cyclohexyl-1,1′-bis[4-(γ-2- methylphenoxy)-hydroxypropylacrylate], was synthesized from 1, 1-bis (3-methyl-4-glycidyloxyphenyl) cyclohexane, and acrylic acid via nucleophilic addition. The structure of VEM was confirmed by FTIR, 1H, 13C NMR, and electron impact-mass spectroscopy. Diglycidyl ethers of bisphenol-A (DGEBA) epoxy resin were toughened with varying percentages of 5, 10, and 15% (by wt) VEM using 4, 4′-diaminodiphenylmethane (DDM). VEM-modified epoxy systems were further modified with organophilic montmorillonite (OMMT) clay. OMMT clay-filled hybrid VEM-epoxy resin systems, developed in the form of casting, were characterized for their mechanical, thermomechanical, dielectric, and morphological properties.
KW - Dielectric properties
KW - epoxy resin
KW - hardness
KW - morphology
KW - water absorption
UR - https://www.scopus.com/pages/publications/84873387726
U2 - 10.1080/00914037.2012.670818
DO - 10.1080/00914037.2012.670818
M3 - Article
AN - SCOPUS:84873387726
SN - 0091-4037
VL - 62
SP - 301
EP - 308
JO - International Journal of Polymeric Materials and Polymeric Biomaterials
JF - International Journal of Polymeric Materials and Polymeric Biomaterials
IS - 6
ER -