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Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages

  • Mohamed Lebbai
  • , Jang Kyo Kim
  • , W. K. Szeto
  • , Matthew M.F. Yuen
  • , Pin Tong
  • The Hong Kong University of Science and Technology
  • QPL Ltd.

Research output: Contribution to journal › Article › peer-review

45 Scopus citations

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