Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages

Mohamed Lebbai, Jang Kyo Kim, W. K. Szeto, Matthew M.F. Yuen, Pin Tong

Research output: Contribution to journalArticlepeer-review

44 Scopus citations

Abstract

Copper-oxide coating applied onto the copper substrate has emerged as an alternative to metallic coatings to improve adhesion with polymeric adhesives and molding compounds. The interfacial-bond strengths between the black oxide-coated Cu substrate and epoxy-based, glob-top resin were measured in button-shear tests, and the failure mechanisms were identified from the fracture-surface examination. The emphasis was to establish the correlation between the coating thickness, the surface roughness, and the interfacial adhesion with respect to treatment time. It was found that at the initial stage of treatment a thin layer of flat, cuprous oxide developed, above which fibrillar-cupric oxide was formed with further treatment until saturation with densified fibrils at about 150 sec. The interfacial-bond strength between the oxide-coated copper substrate and glob-top resin increased gradually with increasing treatment time, until the bond strength reached a plateau constant after a treatment for about 150 sec. There was a functional similarity between the oxide thickness, the surface roughness, and the interface-bond strength with respect to treatment time. A treatment time of 150 sec is considered an optimal condition that can impart the highest interface adhesion.

Original languageBritish English
Pages (from-to)558-563
Number of pages6
JournalJournal of Electronic Materials
Volume32
Issue number6
DOIs
StatePublished - Jun 2003

Keywords

  • Black oxide
  • Coating thickness
  • Copper substrate
  • Interfacial adhesion
  • Surface roughness

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