Optimization of black oxide coating thickness as adhesion promoter for copper substrate

Mohamed Lebbai, W. K. Szeto, Jang Kyo Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

14 Scopus citations

Abstract

Black oxide is a conversion coating applied onto copper surface to improve the interface adhesion with polymeric adhesives and moulding compounds. State-of-the-art analytical instruments, including SEM, TEM, XPS, AFM, XRD, Goniometry, TEM, Dynamic SIMS and RBS were employed to characterize the coated surface and interphase with glob top resins. It was found that the copper oxide layer consists of cupric and cuprous oxides with a continuous change of oxide composition from the top surface to the inside without a distinct boundary in between. Crystallinity of the oxides was barely detected directly from the black oxide coated copper. The cupric oxide exist in the form of a long, fibril structure on nanoscopic scale. The interface bond strength between the copper oxide and glob-top resin increased rapidly in the low range of oxide thickness and became almost constant with further increase in oxide thickness. A functionally similar dependence of oxide thickness and interface adhesion on treatment time was also revealed. Fracture occurred mainly within the oxide layer for black oxide coated substrate (i.e. cohesive failure of black oxide), while fracture tended to occur along the coating-resin interface (i.e. adhesive failure) once the coated surface is debleeded by sandblasting.

Original languageBritish English
Title of host publicationInternational Symposium on Electronic Materials and Packaging, EMAP 2000
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages206-213
Number of pages8
ISBN (Electronic)0780366549, 9780780366541
DOIs
StatePublished - 2000
EventInternational Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, China
Duration: 30 Nov 20002 Dec 2000

Publication series

NameInternational Symposium on Electronic Materials and Packaging, EMAP 2000

Conference

ConferenceInternational Symposium on Electronic Materials and Packaging, EMAP 2000
Country/TerritoryChina
CityHong Kong
Period30/11/002/12/00

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