TY - GEN
T1 - Optimization of black oxide coating thickness as adhesion promoter for copper substrate
AU - Lebbai, Mohamed
AU - Szeto, W. K.
AU - Kim, Jang Kyo
N1 - Publisher Copyright:
© 2000 IEEE.
PY - 2000
Y1 - 2000
N2 - Black oxide is a conversion coating applied onto copper surface to improve the interface adhesion with polymeric adhesives and moulding compounds. State-of-the-art analytical instruments, including SEM, TEM, XPS, AFM, XRD, Goniometry, TEM, Dynamic SIMS and RBS were employed to characterize the coated surface and interphase with glob top resins. It was found that the copper oxide layer consists of cupric and cuprous oxides with a continuous change of oxide composition from the top surface to the inside without a distinct boundary in between. Crystallinity of the oxides was barely detected directly from the black oxide coated copper. The cupric oxide exist in the form of a long, fibril structure on nanoscopic scale. The interface bond strength between the copper oxide and glob-top resin increased rapidly in the low range of oxide thickness and became almost constant with further increase in oxide thickness. A functionally similar dependence of oxide thickness and interface adhesion on treatment time was also revealed. Fracture occurred mainly within the oxide layer for black oxide coated substrate (i.e. cohesive failure of black oxide), while fracture tended to occur along the coating-resin interface (i.e. adhesive failure) once the coated surface is debleeded by sandblasting.
AB - Black oxide is a conversion coating applied onto copper surface to improve the interface adhesion with polymeric adhesives and moulding compounds. State-of-the-art analytical instruments, including SEM, TEM, XPS, AFM, XRD, Goniometry, TEM, Dynamic SIMS and RBS were employed to characterize the coated surface and interphase with glob top resins. It was found that the copper oxide layer consists of cupric and cuprous oxides with a continuous change of oxide composition from the top surface to the inside without a distinct boundary in between. Crystallinity of the oxides was barely detected directly from the black oxide coated copper. The cupric oxide exist in the form of a long, fibril structure on nanoscopic scale. The interface bond strength between the copper oxide and glob-top resin increased rapidly in the low range of oxide thickness and became almost constant with further increase in oxide thickness. A functionally similar dependence of oxide thickness and interface adhesion on treatment time was also revealed. Fracture occurred mainly within the oxide layer for black oxide coated substrate (i.e. cohesive failure of black oxide), while fracture tended to occur along the coating-resin interface (i.e. adhesive failure) once the coated surface is debleeded by sandblasting.
UR - http://www.scopus.com/inward/record.url?scp=33745688337&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2000.904156
DO - 10.1109/EMAP.2000.904156
M3 - Conference contribution
AN - SCOPUS:33745688337
T3 - International Symposium on Electronic Materials and Packaging, EMAP 2000
SP - 206
EP - 213
BT - International Symposium on Electronic Materials and Packaging, EMAP 2000
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Symposium on Electronic Materials and Packaging, EMAP 2000
Y2 - 30 November 2000 through 2 December 2000
ER -