TY - GEN
T1 - On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS
AU - Bojesomo, Alabi
AU - Syed, Wajih
AU - Elfadel, Ibrahim Abe M.
N1 - Funding Information:
This work is funded by the Mubadala Investment Company -Abu Dhabi, Economic Development Board - Singapore, and GLOBALFOUNDRIES - Singapore under the framework of the MEMS TwinLab program with participation of the A*STAR Institute of Microelectronics - Singapore (IME), Masdar Institute at Khalifa University - Abu Dhabi, and GLOBALFOUNDRIES - Singapore.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/22
Y1 - 2018/6/22
N2 - Reliability considerations in multi-wafer, vacuum- packaged MEMS often require the usage of bonding pillars connecting the top and bottom capping wafers. Such bonding pillars in turn require the etching of holes into the device wafer. Placement constraints sometimes necessitate that these holes be etched through the mechanical element itself, be it the beam, the membrane or the proofmass. In this paper, we use the example of a micro-scale piezoelectric energy harvesting platform to incorporate the effect of bonding-pillar holes of arbitrary shapes and sizes in the electromechanical model of the device. In particular, we develop the corresponding multi-modal equivalent circuit model (ECM) and use a MEMS-CMOS co-simulation environment to obtain the single-mode terminal voltage output under resistive loads. The ECM has been fully validated using 3D Finite Element analysis, and the impact of bonding-pillar holes on device metrics has been compactly parameterised for the first time. This modeling approach is included in a new design framework for device structural integrity whose goal is the optimal placement and sizing of bonding pillars in multi- wafer, vacuum-packaged MEMS.
AB - Reliability considerations in multi-wafer, vacuum- packaged MEMS often require the usage of bonding pillars connecting the top and bottom capping wafers. Such bonding pillars in turn require the etching of holes into the device wafer. Placement constraints sometimes necessitate that these holes be etched through the mechanical element itself, be it the beam, the membrane or the proofmass. In this paper, we use the example of a micro-scale piezoelectric energy harvesting platform to incorporate the effect of bonding-pillar holes of arbitrary shapes and sizes in the electromechanical model of the device. In particular, we develop the corresponding multi-modal equivalent circuit model (ECM) and use a MEMS-CMOS co-simulation environment to obtain the single-mode terminal voltage output under resistive loads. The ECM has been fully validated using 3D Finite Element analysis, and the impact of bonding-pillar holes on device metrics has been compactly parameterised for the first time. This modeling approach is included in a new design framework for device structural integrity whose goal is the optimal placement and sizing of bonding pillars in multi- wafer, vacuum-packaged MEMS.
UR - https://www.scopus.com/pages/publications/85050209726
U2 - 10.1109/DTIP.2018.8394181
DO - 10.1109/DTIP.2018.8394181
M3 - Conference contribution
AN - SCOPUS:85050209726
T3 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
SP - 1
EP - 4
BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
A2 - Marcelli, Romolo
A2 - Mita, Yoshio
A2 - Smith, Stewart
A2 - Pressecq, Francis
A2 - Nouet, Pascal
A2 - Mailly, Frederick
A2 - Schneider, Peter
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
Y2 - 22 May 2018 through 25 May 2018
ER -