On-chip bus interleaving revisited

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Repeater interleaving is used to reduce the impact of capacitive coupling noise on the worst-case delay in local on-chip RC buses. In this paper, we revisit this interconnect design practice to evaluate it from the viewpoint of signal integrity of global on-chip interconnect used in on-chip high-speed signaling as between a cache and a CPU. Using accurate R(f)L(f)C electrical models of the global bus, we show that the peak crosstalk noise exhibits both monotonic and convex dependence on the interleaving ratio. Furthermore, we show that the worst-case switching pattern used in quantifying the common-mode noise (CMN) on the bus depends on the repeater interleaving ratio. This dependence makes the search of the optimal ratio that minimizes bus CMN quite challenging. The conclusions of this paper are valid for both unidirectional and bidirectional buses.

Original languageBritish English
Title of host publication14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages323-326
Number of pages4
DOIs
StatePublished - 2005
Event14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States
Duration: 24 Oct 200526 Oct 2005

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2005

Conference

Conference14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/TerritoryUnited States
CityAustin, TX
Period24/10/0526/10/05

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