Numerical prediction of electronic component heat transfer: An industry perspective

Valérie Eveloy; Peter Rodgers; M. S.J. Hashmi

Numerical prediction of electronic component heat transfer: An industry perspective

Valérie Eveloy, Peter Rodgers, M. S.J. Hashmi

Mechanical & Nuclear Engineering

Dublin City University

Research output: Contribution to journal › Conference article › peer-review

18 Scopus citations

Abstract

This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

Original language	British English
Pages (from-to)	14-26
Number of pages	13
Journal	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
State	Published - 2003
Event	Nineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States Duration: 11 Mar 2003 → 13 Mar 2003

Keywords

Benchmark
CFD
Component
Electronics cooling
Modeling
PCB
Prediction
Reliability
Virtual prototyping

Cite this

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title = "Numerical prediction of electronic component heat transfer: An industry perspective",

abstract = "This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.",

keywords = "Benchmark, CFD, Component, Electronics cooling, Modeling, PCB, Prediction, Reliability, Virtual prototyping",

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year = "2003",

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journal = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

issn = "1065-2221",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Nineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium ; Conference date: 11-03-2003 Through 13-03-2003",

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TY - JOUR

T1 - Numerical prediction of electronic component heat transfer

T2 - Nineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium

AU - Eveloy, Valérie

AU - Rodgers, Peter

AU - Hashmi, M. S.J.

PY - 2003

Y1 - 2003

N2 - This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

AB - This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

KW - Benchmark

KW - CFD

KW - Component

KW - Electronics cooling

KW - Modeling

KW - PCB

KW - Prediction

KW - Reliability

KW - Virtual prototyping

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M3 - Conference article

AN - SCOPUS:0037275702

SN - 1065-2221

SP - 14

EP - 26

JO - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

JF - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Y2 - 11 March 2003 through 13 March 2003

ER -

Numerical prediction of electronic component heat transfer: An industry perspective

Abstract

Keywords

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