Numerical prediction of electronic component heat transfer: An industry perspective

Valérie Eveloy, Peter Rodgers, M. S.J. Hashmi

Research output: Contribution to journalConference articlepeer-review

18 Scopus citations


This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)-mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

Original languageBritish English
Pages (from-to)14-26
Number of pages13
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
StatePublished - 2003
EventNineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States
Duration: 11 Mar 200313 Mar 2003


  • Benchmark
  • CFD
  • Component
  • Electronics cooling
  • Modeling
  • PCB
  • Prediction
  • Reliability
  • Virtual prototyping


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