TY - JOUR
T1 - Numerical analysis of ultrasonic wire bonding
T2 - Effects of bonding parameters on contact pressure and frictional energy
AU - Ding, Yong
AU - Kim, Jang Kyo
AU - Tong, Pin
N1 - Funding Information:
This paper is presented at the International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials (MM2003), which is dedicated to Professor Pin Tong on the occasion of his 65th birthday. This work has been supported by the Research Grant Council (RGC) of Hong Kong and the postdoctoral matching fund of HKUST. The first author (YD) was a visiting scholar when this work was performed.
PY - 2006/1
Y1 - 2006/1
N2 - The elasto-plastic large deformation taking place in ultrasonic wire bonding is analysed by means of 2-D and 3-D finite element method. A special focus has been placed on how the important wire bonding parameters, such as bond force and power, affect the contact pressure along the wire-bond pad interface. It is shown that the contact interface had a long elliptical shape, and the maximum contact pressure occurred always at the periphery of the contact interface, which is consistent in the current 2-D and 3-D finite element analyses. The normalised real contact area as well as the maximum frictional energy intensity varied in a similar manner to the contact pressure, with the maximum values occurring at the periphery of contact interface, where weld is preferentially formed in practical wire bonding. A higher bond force does not result in a higher contact pressure, or higher frictional energy intensity, suggesting that a high bond force is not directly correlated to better wire bondability.
AB - The elasto-plastic large deformation taking place in ultrasonic wire bonding is analysed by means of 2-D and 3-D finite element method. A special focus has been placed on how the important wire bonding parameters, such as bond force and power, affect the contact pressure along the wire-bond pad interface. It is shown that the contact interface had a long elliptical shape, and the maximum contact pressure occurred always at the periphery of the contact interface, which is consistent in the current 2-D and 3-D finite element analyses. The normalised real contact area as well as the maximum frictional energy intensity varied in a similar manner to the contact pressure, with the maximum values occurring at the periphery of contact interface, where weld is preferentially formed in practical wire bonding. A higher bond force does not result in a higher contact pressure, or higher frictional energy intensity, suggesting that a high bond force is not directly correlated to better wire bondability.
KW - Contact pressure
KW - Finite element method
KW - Frictional energy intensity
KW - Ultrasonic wire bonding
KW - Wire bondability
UR - http://www.scopus.com/inward/record.url?scp=27744498826&partnerID=8YFLogxK
U2 - 10.1016/j.mechmat.2005.05.007
DO - 10.1016/j.mechmat.2005.05.007
M3 - Article
AN - SCOPUS:27744498826
SN - 0167-6636
VL - 38
SP - 11
EP - 24
JO - Mechanics of Materials
JF - Mechanics of Materials
IS - 1-2
ER -