TY - GEN
T1 - Novel X-band Loaded Circular Aperture Probe for Imaging of Multilayer Composites
AU - Saif Ur Rahman, Mohammed
AU - Al-Wahedi, Khaled
AU - Abou-Khousa, Mohamed A.
AU - Akhter, Zubair
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/11
Y1 - 2019/11
N2 - Composite materials are being used in a plethora of applications these days due to advantageous features like low weight, high strength and stiffness. However, they are vulnerable to various anomalies, which require periodic inspection to prevent major catastrophes. Microwave near field imaging has demonstrated remarkable capability in detecting subsurface defects in composites. In this paper, a novel circular aperture probe loaded with a resonant iris, operating in X-band frequency range is proposed for near field imaging. To illustrate the effectiveness of the probe, its imaging performance for multilayer composites is compared to a rectangular waveguide. It is elucidated that the proposed probe produces images of high quality with relatively higher dynamic range.
AB - Composite materials are being used in a plethora of applications these days due to advantageous features like low weight, high strength and stiffness. However, they are vulnerable to various anomalies, which require periodic inspection to prevent major catastrophes. Microwave near field imaging has demonstrated remarkable capability in detecting subsurface defects in composites. In this paper, a novel circular aperture probe loaded with a resonant iris, operating in X-band frequency range is proposed for near field imaging. To illustrate the effectiveness of the probe, its imaging performance for multilayer composites is compared to a rectangular waveguide. It is elucidated that the proposed probe produces images of high quality with relatively higher dynamic range.
KW - circular aperture probe
KW - composites
KW - near-field microwave imaging
KW - non-destructive testing
UR - http://www.scopus.com/inward/record.url?scp=85078932581&partnerID=8YFLogxK
U2 - 10.1109/ICECTA48151.2019.8959667
DO - 10.1109/ICECTA48151.2019.8959667
M3 - Conference contribution
AN - SCOPUS:85078932581
T3 - 2019 International Conference on Electrical and Computing Technologies and Applications, ICECTA 2019
BT - 2019 International Conference on Electrical and Computing Technologies and Applications, ICECTA 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Conference on Electrical and Computing Technologies and Applications, ICECTA 2019
Y2 - 19 November 2019 through 21 November 2019
ER -