Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard

    Research output: Contribution to journalArticlepeer-review

    64 Scopus citations


    This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

    Original languageBritish English
    Article number8926422
    Pages (from-to)6916-6930
    Number of pages15
    JournalIEEE Transactions on Power Electronics
    Issue number7
    StatePublished - 1 Jul 2020


    • Modular multilevel converters (MMCs)
    • power losses
    • redundancy
    • reliability
    • thermal analysis


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