Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

Tie Jun Zhang; John T. Wen; Yoav Peles; Tao Tong; Je Young Chang; Ravi Prasher; Michael K. Jensen

doi:10.1109/COASE.2010.5584171

Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

Tie Jun Zhang, John T. Wen, Yoav Peles, Tao Tong, Je Young Chang, Ravi Prasher, Michael K. Jensen

Mechanical & Nuclear Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

Original language	British English
Title of host publication	2010 IEEE International Conference on Automation Science and Engineering, CASE 2010
Pages	750-755
Number of pages	6
DOIs	https://doi.org/10.1109/COASE.2010.5584171
State	Published - 2010
Event	2010 IEEE International Conference on Automation Science and Engineering, CASE 2010 - Toronto, ON, Canada Duration: 21 Aug 2010 → 24 Aug 2010

Publication series

Name	2010 IEEE International Conference on Automation Science and Engineering, CASE 2010

Conference

Conference	2010 IEEE International Conference on Automation Science and Engineering, CASE 2010
Country/Territory	Canada
City	Toronto, ON
Period	21/08/10 → 24/08/10

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10.1109/COASE.2010.5584171

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Zhang, T. J., Wen, J. T., Peles, Y., Tong, T., Chang, J. Y., Prasher, R., & Jensen, M. K. (2010). Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling. In 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010 (pp. 750-755). Article 5584171 (2010 IEEE International Conference on Automation Science and Engineering, CASE 2010). https://doi.org/10.1109/COASE.2010.5584171

@inproceedings{af5caa39ffcd4a19b5a08466c522d4a2,

title = "Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling",

abstract = "Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.",

author = "Zhang, {Tie Jun} and Wen, {John T.} and Yoav Peles and Tao Tong and Chang, {Je Young} and Ravi Prasher and Jensen, {Michael K.}",

year = "2010",

doi = "10.1109/COASE.2010.5584171",

language = "British English",

isbn = "9781424454471",

series = "2010 IEEE International Conference on Automation Science and Engineering, CASE 2010",

pages = "750--755",

booktitle = "2010 IEEE International Conference on Automation Science and Engineering, CASE 2010",

note = "2010 IEEE International Conference on Automation Science and Engineering, CASE 2010 ; Conference date: 21-08-2010 Through 24-08-2010",

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Zhang, TJ, Wen, JT, Peles, Y, Tong, T, Chang, JY, Prasher, R & Jensen, MK 2010, Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling. in 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010., 5584171, 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010, pp. 750-755, 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010, Toronto, ON, Canada, 21/08/10. https://doi.org/10.1109/COASE.2010.5584171

Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling. / Zhang, Tie Jun; Wen, John T.; Peles, Yoav et al.
2010 IEEE International Conference on Automation Science and Engineering, CASE 2010. 2010. p. 750-755 5584171 (2010 IEEE International Conference on Automation Science and Engineering, CASE 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

AU - Zhang, Tie Jun

AU - Wen, John T.

AU - Peles, Yoav

AU - Tong, Tao

AU - Chang, Je Young

AU - Prasher, Ravi

AU - Jensen, Michael K.

PY - 2010

Y1 - 2010

N2 - Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

AB - Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

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U2 - 10.1109/COASE.2010.5584171

DO - 10.1109/COASE.2010.5584171

M3 - Conference contribution

AN - SCOPUS:78149428044

SN - 9781424454471

T3 - 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010

SP - 750

EP - 755

BT - 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010

T2 - 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010

Y2 - 21 August 2010 through 24 August 2010

ER -

Zhang TJ, Wen JT, Peles Y, Tong T, Chang JY, Prasher R et al. Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling. In 2010 IEEE International Conference on Automation Science and Engineering, CASE 2010. 2010. p. 750-755. 5584171. (2010 IEEE International Conference on Automation Science and Engineering, CASE 2010). doi: 10.1109/COASE.2010.5584171

Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

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