Message from the Technical Program Chairs

Research output: Contribution to journal › Editorial

Original language	British English
Pages (from-to)	i-ii
Journal	IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC
DOIs	https://doi.org/10.1109/VLSI-SoC57769.2023.10321897
State	Published - 2023
Event	31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023 - Dubai, United Arab Emirates Duration: 16 Oct 2023 → 18 Oct 2023

Access to Document

@article{36d059a6230341ca96b0f5eb47421585,

title = "Message from the Technical Program Chairs",

author = "Abe Elfadel and Lutfi Albasha",

year = "2023",

doi = "10.1109/VLSI-SoC57769.2023.10321897",

language = "British English",

pages = "i--ii",

journal = "IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC",

issn = "2324-8432",

publisher = "IEEE Computer Society",

note = "31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023 ; Conference date: 16-10-2023 Through 18-10-2023",

}

TY - JOUR

T1 - Message from the Technical Program Chairs

AU - Elfadel, Abe

AU - Albasha, Lutfi

PY - 2023

Y1 - 2023

UR - https://www.scopus.com/pages/publications/85180084909

U2 - 10.1109/VLSI-SoC57769.2023.10321897

DO - 10.1109/VLSI-SoC57769.2023.10321897

M3 - Editorial

AN - SCOPUS:85180084909

SN - 2324-8432

SP - i-ii

JO - IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC

JF - IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC

T2 - 31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023

Y2 - 16 October 2023 through 18 October 2023

ER -