Measurement of residual stresses in flip chip underfill resins

Man Lung Sham; Jang Kyo Kim

Measurement of residual stresses in flip chip underfill resins

Man Lung Sham, Jang Kyo Kim

Mechanical & Nuclear Engineering

The Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Flip chip interconnection technology provides a solution to the increasing demands for miniaturisation and weight reduction for applications in portable electronics. The technology enables direct attachment of chips to printed circuit boards through solder joints. The gap between the chip and board is encapsulated with an underfill resin to improve the mechanical/thermal performance and thus the reliability of package. During the curing process of underfill, large residual stresses are generated due to the chemical shrinkage of polymer and the thermal mismatches between the various package components. The rheological/thermomechanical properties and curing kinetics of underfill resin are important factors that affect the magnitude and distribution of residual stresses. These thermal stresses are the principle cause of device failure after temperature cyclic tests. The bi-material strip bending experiment is carried out, where a thin film of underfill resin is applied onto a thin rectangular glass slide, the assembly of which is subjected to a curing temperature excursion. The evolution of residual stresses in the resin is in situ monitored within the temperature chamber using a linear variable differential transformer (LVDT) connected to a micro-load cell. Multiple stages of residual stress generation are identified. The coefficients of thermal expansion (CTEs) of underfill resin are characterised based on a thermo-mechanical analysis, which are well compared with those determined from other sources.

Original language	British English
Title of host publication	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Subtitle of host publication	Incoperating POLY, PEP and Adhasives in Electronics
Pages	160-167
Number of pages	8
State	Published - 2001
Event	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) - Potsdam, Germany Duration: 21 Oct 2001 → 24 Oct 2001

Publication series

Name	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Conference

Conference	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001)
Country/Territory	Germany
City	Potsdam
Period	21/10/01 → 24/10/01

Keywords

Coefficient of thermal expansion
Flip chip package
Residual stresses
Thermo-mechanical analysis

Cite this

Sham, M. L., & Kim, J. K. (2001). Measurement of residual stresses in flip chip underfill resins. In First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics (pp. 160-167). (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Sham, Man Lung ; Kim, Jang Kyo. / Measurement of residual stresses in flip chip underfill resins. First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. pp. 160-167 (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

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title = "Measurement of residual stresses in flip chip underfill resins",

abstract = "Flip chip interconnection technology provides a solution to the increasing demands for miniaturisation and weight reduction for applications in portable electronics. The technology enables direct attachment of chips to printed circuit boards through solder joints. The gap between the chip and board is encapsulated with an underfill resin to improve the mechanical/thermal performance and thus the reliability of package. During the curing process of underfill, large residual stresses are generated due to the chemical shrinkage of polymer and the thermal mismatches between the various package components. The rheological/thermomechanical properties and curing kinetics of underfill resin are important factors that affect the magnitude and distribution of residual stresses. These thermal stresses are the principle cause of device failure after temperature cyclic tests. The bi-material strip bending experiment is carried out, where a thin film of underfill resin is applied onto a thin rectangular glass slide, the assembly of which is subjected to a curing temperature excursion. The evolution of residual stresses in the resin is in situ monitored within the temperature chamber using a linear variable differential transformer (LVDT) connected to a micro-load cell. Multiple stages of residual stress generation are identified. The coefficients of thermal expansion (CTEs) of underfill resin are characterised based on a thermo-mechanical analysis, which are well compared with those determined from other sources.",

keywords = "Coefficient of thermal expansion, Flip chip package, Residual stresses, Thermo-mechanical analysis",

author = "Sham, {Man Lung} and Kim, {Jang Kyo}",

year = "2001",

language = "British English",

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series = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics",

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booktitle = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics",

note = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) ; Conference date: 21-10-2001 Through 24-10-2001",

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Sham, ML & Kim, JK 2001, Measurement of residual stresses in flip chip underfill resins. in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics, pp. 160-167, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001), Potsdam, Germany, 21/10/01.

Measurement of residual stresses in flip chip underfill resins. / Sham, Man Lung; Kim, Jang Kyo.
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. p. 160-167 (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Measurement of residual stresses in flip chip underfill resins

AU - Sham, Man Lung

AU - Kim, Jang Kyo

PY - 2001

Y1 - 2001

N2 - Flip chip interconnection technology provides a solution to the increasing demands for miniaturisation and weight reduction for applications in portable electronics. The technology enables direct attachment of chips to printed circuit boards through solder joints. The gap between the chip and board is encapsulated with an underfill resin to improve the mechanical/thermal performance and thus the reliability of package. During the curing process of underfill, large residual stresses are generated due to the chemical shrinkage of polymer and the thermal mismatches between the various package components. The rheological/thermomechanical properties and curing kinetics of underfill resin are important factors that affect the magnitude and distribution of residual stresses. These thermal stresses are the principle cause of device failure after temperature cyclic tests. The bi-material strip bending experiment is carried out, where a thin film of underfill resin is applied onto a thin rectangular glass slide, the assembly of which is subjected to a curing temperature excursion. The evolution of residual stresses in the resin is in situ monitored within the temperature chamber using a linear variable differential transformer (LVDT) connected to a micro-load cell. Multiple stages of residual stress generation are identified. The coefficients of thermal expansion (CTEs) of underfill resin are characterised based on a thermo-mechanical analysis, which are well compared with those determined from other sources.

AB - Flip chip interconnection technology provides a solution to the increasing demands for miniaturisation and weight reduction for applications in portable electronics. The technology enables direct attachment of chips to printed circuit boards through solder joints. The gap between the chip and board is encapsulated with an underfill resin to improve the mechanical/thermal performance and thus the reliability of package. During the curing process of underfill, large residual stresses are generated due to the chemical shrinkage of polymer and the thermal mismatches between the various package components. The rheological/thermomechanical properties and curing kinetics of underfill resin are important factors that affect the magnitude and distribution of residual stresses. These thermal stresses are the principle cause of device failure after temperature cyclic tests. The bi-material strip bending experiment is carried out, where a thin film of underfill resin is applied onto a thin rectangular glass slide, the assembly of which is subjected to a curing temperature excursion. The evolution of residual stresses in the resin is in situ monitored within the temperature chamber using a linear variable differential transformer (LVDT) connected to a micro-load cell. Multiple stages of residual stress generation are identified. The coefficients of thermal expansion (CTEs) of underfill resin are characterised based on a thermo-mechanical analysis, which are well compared with those determined from other sources.

KW - Coefficient of thermal expansion

KW - Flip chip package

KW - Residual stresses

KW - Thermo-mechanical analysis

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M3 - Conference contribution

AN - SCOPUS:0035791294

SN - 0780372204

T3 - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

SP - 160

EP - 167

BT - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

T2 - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001)

Y2 - 21 October 2001 through 24 October 2001

ER -

Sham ML, Kim JK. Measurement of residual stresses in flip chip underfill resins. In First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. p. 160-167. (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Measurement of residual stresses in flip chip underfill resins

Abstract

Publication series

Conference

Keywords

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