Measurement of Maximum dIC/dt with Printed Circuit Board Rogowski Coil for Junction Temperature Estimation of IGBT Modules

Yafei Shi, Huai Wang, Yichao Duan, Jianlong Kang, Zhen Xin

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    1 Scopus citations

    Abstract

    Junction temperature monitoring is crucial for the reliable operation of IGBT modules in many applications. The maximum collector current falling rate is an effective temperature-sensitive electrical parameter, which has good linearity and can be detected on-line. It has been reported that the parasitic inductance between the power and Kelvin emitter of IGBT modules can be used directly as the sensor for maximum collector current falling rate, nevertheless this method relies on the Kelvin structure and may introduce additional parasitic parameters. To solve this problem, the printed circuit board (PCB) Rogowski coil is proposed to measure the collector current falling rate, which has the advantage of contact-less and can be integrated with the driver circuit. In this paper, the temperature dependence of the maximum collector current falling rate and the measurement principle of Rogowski coil are analyzed. Moreover a double pulse test platform based on IGBT module is built to verify the effectiveness of the proposed method.

    Original languageBritish English
    Title of host publication2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    ISBN (Electronic)9781728193878
    DOIs
    StatePublished - 2022
    Event2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 - Detroit, United States
    Duration: 9 Oct 202213 Oct 2022

    Publication series

    Name2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

    Conference

    Conference2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
    Country/TerritoryUnited States
    CityDetroit
    Period9/10/2213/10/22

    Keywords

    • IGBT
    • integration
    • junction temperature
    • maximum collector current falling rate
    • printed circuit board Rogowski coil

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