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Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications

  • Eric Eisenbraun
  • , Allan Upham
  • , Raj Dash
  • , Wanxue Zeng
  • , Johann Hoefnagels
  • , Sarah Lane
  • , Dalaver Anjum
  • , Katharine Dovidenko
  • , Alain Kaloyeros
  • , Barry Arkles
  • , John J. Sullivan
  • University at Albany
  • Gelest Incorporated
  • MKS Instruments

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

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