Limits of air-cooling: Status and challenges

Peter Rodgers; Valérie Eveloy; Michael G. Pecht

Limits of air-cooling: Status and challenges

Peter Rodgers, Valérie Eveloy, Michael G. Pecht

Mechanical & Nuclear Engineering

University of Maryland

Research output: Contribution to journal › Conference article › peer-review

43 Scopus citations

Abstract

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

Original language	British English
Pages (from-to)	116-124
Number of pages	9
Journal	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
State	Published - 2005
Event	21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States Duration: 15 Mar 2005 → 17 Mar 2005

Keywords

Air-cooling
Convection
Fan
Fouling
Heat sink
PCM
Phase change material
Thermal interface material
TIM

Cite this

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title = "Limits of air-cooling: Status and challenges",

abstract = "Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.",

keywords = "Air-cooling, Convection, Fan, Fouling, Heat sink, PCM, Phase change material, Thermal interface material, TIM",

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AU - Eveloy, Valérie

AU - Pecht, Michael G.

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Y1 - 2005

N2 - Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

AB - Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

KW - Air-cooling

KW - Convection

KW - Fan

KW - Fouling

KW - Heat sink

KW - PCM

KW - Phase change material

KW - Thermal interface material

KW - TIM

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M3 - Conference article

AN - SCOPUS:28144462455

SN - 1065-2221

SP - 116

EP - 124

JO - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

JF - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Y2 - 15 March 2005 through 17 March 2005

ER -

Limits of air-cooling: Status and challenges

Abstract

Keywords

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