Limits of air-cooling: Status and challenges

Peter Rodgers, Valérie Eveloy, Michael G. Pecht

Research output: Contribution to journalConference articlepeer-review

42 Scopus citations

Abstract

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

Original languageBritish English
Pages (from-to)116-124
Number of pages9
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
StatePublished - 2005
Event21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, United States
Duration: 15 Mar 200517 Mar 2005

Keywords

  • Air-cooling
  • Convection
  • Fan
  • Fouling
  • Heat sink
  • PCM
  • Phase change material
  • Thermal interface material
  • TIM

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