Kenaf MDF panels: A statistical approach in parameter selection

Engineering

• Black Carbon 100%
• Electrical Conductivity 66%
• Conductive 33%
• Surface Coating 33%
• Taguchi Method 33%
• Interfacial Bonding 33%
• Modulus of Rupture 33%
• Medium Density Fibreboard 33%
• Conductive Filler 33%
• Multivariable System 33%
• Urea-Formaldehyde Resin 33%
• Panel Thickness 33%
• Bioresins 33%
• Bond Strength 33%
• Modulus of Elasticity 33%

Material Science

• Electrical Conductivity 100%
• Elastic Moduli 50%
• Density 50%
• Complex Systems 50%
• Taguchi Method 50%
• Surface Coating 50%
• Powder Coating 50%
• Urea 50%

Chemical Engineering

• Carbon Black 100%
• Urea Formaldehyde Resins 33%
• Multivariable System 33%