Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment

Man Lung Ivan Sham; Jang Kyo Kim

doi:10.1109/TADVP.2004.825452

Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment

Man Lung Ivan Sham
, Jang Kyo Kim

Mechanical & Nuclear Engineering

The Hong Kong University of Science and Technology

Research output: Contribution to journal › Article › peer-review

13 Scopus citations

Abstract

The interfacial adhesion between the epoxy-based soldermask and underfill resin is successfully improved by means of ultraviolet light/ozone (UV/O₃) treatment. There is an optimized treatment condition that can impart the highest interfacial bond quality. The underlying mechanisms are evaluated based on several techniques, including X-ray photoelectron spectroscopy (XPS), contact angle measurement and nanoindentation of the UV/O₃ treated soldermask surface. Functionally similar changes in chemical element, wettability, and elastic modulus are identified of the substrate with respect to treatment time, which are also correlated to the improvement of interfacial bond strength. In particular, there is a linear relationship between the weighted dipole moment (obtained from the XPS analysis) and the surface polarity (calculated from the contact and measurements) of the treated surface, confirming that the same conclusion can be drawn from the two different techniques. The UV/O₃ treatment is proven to be efficient in retaining the interfacial bond quality even after hygrothermal ageing.

Original language	British English
Pages (from-to)	179-187
Number of pages	9
Journal	IEEE Transactions on Advanced Packaging
Volume	27
Issue number	1
DOIs	https://doi.org/10.1109/TADVP.2004.825452
State	Published - Feb 2004

Keywords

Contact angle
Flip-chip package
Interfacial adhesion
Soldermask
Underfill
UV/ozone

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10.1109/TADVP.2004.825452

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title = "Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment",

abstract = "The interfacial adhesion between the epoxy-based soldermask and underfill resin is successfully improved by means of ultraviolet light/ozone (UV/O3) treatment. There is an optimized treatment condition that can impart the highest interfacial bond quality. The underlying mechanisms are evaluated based on several techniques, including X-ray photoelectron spectroscopy (XPS), contact angle measurement and nanoindentation of the UV/O3 treated soldermask surface. Functionally similar changes in chemical element, wettability, and elastic modulus are identified of the substrate with respect to treatment time, which are also correlated to the improvement of interfacial bond strength. In particular, there is a linear relationship between the weighted dipole moment (obtained from the XPS analysis) and the surface polarity (calculated from the contact and measurements) of the treated surface, confirming that the same conclusion can be drawn from the two different techniques. The UV/O3 treatment is proven to be efficient in retaining the interfacial bond quality even after hygrothermal ageing.",

keywords = "Contact angle, Flip-chip package, Interfacial adhesion, Soldermask, Underfill, UV/ozone",

author = "Sham, \{Man Lung Ivan\} and Kim, \{Jang Kyo\}",

note = "Funding Information: Manuscript received April 24, 2003; revised December 15, 2003. This work was supported by Daeduck Electronics Company, Korea, the Materials Characterization and Preparation Facilities (MCPF), the Advanced Engineering Materials Facilities (AEMF), Design and Manufacturing Services Facility (DMSF), EPack Laboratory, HKUST, and Grants from the Research Grants Council, Hong Kong Special Administrative Region, China.",

year = "2004",

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doi = "10.1109/TADVP.2004.825452",

language = "British English",

volume = "27",

pages = "179--187",

journal = "IEEE Transactions on Advanced Packaging",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

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AU - Sham, Man Lung Ivan

AU - Kim, Jang Kyo

N1 - Funding Information: Manuscript received April 24, 2003; revised December 15, 2003. This work was supported by Daeduck Electronics Company, Korea, the Materials Characterization and Preparation Facilities (MCPF), the Advanced Engineering Materials Facilities (AEMF), Design and Manufacturing Services Facility (DMSF), EPack Laboratory, HKUST, and Grants from the Research Grants Council, Hong Kong Special Administrative Region, China.

PY - 2004/2

Y1 - 2004/2

N2 - The interfacial adhesion between the epoxy-based soldermask and underfill resin is successfully improved by means of ultraviolet light/ozone (UV/O3) treatment. There is an optimized treatment condition that can impart the highest interfacial bond quality. The underlying mechanisms are evaluated based on several techniques, including X-ray photoelectron spectroscopy (XPS), contact angle measurement and nanoindentation of the UV/O3 treated soldermask surface. Functionally similar changes in chemical element, wettability, and elastic modulus are identified of the substrate with respect to treatment time, which are also correlated to the improvement of interfacial bond strength. In particular, there is a linear relationship between the weighted dipole moment (obtained from the XPS analysis) and the surface polarity (calculated from the contact and measurements) of the treated surface, confirming that the same conclusion can be drawn from the two different techniques. The UV/O3 treatment is proven to be efficient in retaining the interfacial bond quality even after hygrothermal ageing.

AB - The interfacial adhesion between the epoxy-based soldermask and underfill resin is successfully improved by means of ultraviolet light/ozone (UV/O3) treatment. There is an optimized treatment condition that can impart the highest interfacial bond quality. The underlying mechanisms are evaluated based on several techniques, including X-ray photoelectron spectroscopy (XPS), contact angle measurement and nanoindentation of the UV/O3 treated soldermask surface. Functionally similar changes in chemical element, wettability, and elastic modulus are identified of the substrate with respect to treatment time, which are also correlated to the improvement of interfacial bond strength. In particular, there is a linear relationship between the weighted dipole moment (obtained from the XPS analysis) and the surface polarity (calculated from the contact and measurements) of the treated surface, confirming that the same conclusion can be drawn from the two different techniques. The UV/O3 treatment is proven to be efficient in retaining the interfacial bond quality even after hygrothermal ageing.

KW - Contact angle

KW - Flip-chip package

KW - Interfacial adhesion

KW - Soldermask

KW - Underfill

KW - UV/ozone

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U2 - 10.1109/TADVP.2004.825452

DO - 10.1109/TADVP.2004.825452

M3 - Article

AN - SCOPUS:2442484738

SN - 1521-3323

VL - 27

SP - 179

EP - 187

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

IS - 1

ER -

Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment

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Keywords

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