Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter

Yi Zhang, Huai Wang, Zhongxu Wang, Yongheng Yang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    7 Scopus citations

    Abstract

    The reliability of the Modular Multilevel Converter (MMC) is of great interest in industrial applications, where the dominant failure mechanism of IGBT modules in an MMC system is temperature-related. In this regard, thermal modeling is critical to map the power losses to thermal profiles and then to predict the lifetime. Even though the Thermal Interface Materials (TIMs) in IGBT modules have a considerable influence on the thermal resistance, the thickness of TIMs is often spuriously considered as a constant according to the thermal conductivity or information in the datasheet. This may lead to misleading results in the lifetime prediction. Hence, this paper investigates the impact of the TIM thickness on the estimated lifetime of IGBT modules in an MMC system for offshore wind power applications, including the starting assembly thickness and the Bond-Line Thickness (BLT) of TIMs. In a 30-MW MMC case study, the lifetime of the IGBT modules is discussed with respect to two values of starting thickness and variable BLT from 20 μm to 60 μm. Experiments are also carried out on a scaled-down system to validate the impact of the TIM thicknesses on the reliability prediction.

    Original languageBritish English
    Title of host publication2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages2743-2749
    Number of pages7
    ISBN (Electronic)9784886864055
    DOIs
    StatePublished - 22 Oct 2018
    Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
    Duration: 20 May 201824 May 2018

    Publication series

    Name2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

    Conference

    Conference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
    Country/TerritoryJapan
    CityNiigata
    Period20/05/1824/05/18

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