TY - GEN
T1 - Impact of Mission Profile Dynamics on Accuracy of Thermal Stress Modeling in PV Inverters
AU - Sangwongwanich, Ariya
AU - Wang, Huai
AU - Blaabjerg, Frede
N1 - Funding Information:
This work was supported in part by Innovation Fund Denmark through the Advanced Power Electronic Technology and Tools (APETT) project and in part by the Reliable Power Electronic-Based Power System (REPEPS) project at the Department of Energy Technology, Aalborg University as a part of the Villum Investigator Program funded by the Villum Foundation.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/10/11
Y1 - 2020/10/11
N2 - Thermal stress modeling of power devices is a key factor that influences the design for reliability of Photovoltaic (PV) inverters under long-term operations, i.e., different mission profiles. Due to the requirement of long-term analysis for mapping the inverter reliability more accurately, a thermal model based on a lumped thermal network is normally employed due to its low computational burden. However, there is still a lack of validation in terms of modeling accuracy, e.g., comparing the simulation results against the experimental thermal stress in field operations. Besides, the impact of mission profile dynamics on the accuracy of different thermal modeling approaches have not been analyzed. To address this issue, the model accuracy of two thermal stress modeling approaches for PV inverters are evaluated in this paper by comparing the thermal stress estimated from a thermal model with the experimental results under various mission profile dynamics. According to the results, the average error of the junction temperature estimation is 1.51 % for a transient thermal model and 2.08 % for a steady-state thermal model, respectively. On the other hand, the computational efficiency of the thermal stress modeling can be improved by more than a factor of three when using the steady-state thermal model.
AB - Thermal stress modeling of power devices is a key factor that influences the design for reliability of Photovoltaic (PV) inverters under long-term operations, i.e., different mission profiles. Due to the requirement of long-term analysis for mapping the inverter reliability more accurately, a thermal model based on a lumped thermal network is normally employed due to its low computational burden. However, there is still a lack of validation in terms of modeling accuracy, e.g., comparing the simulation results against the experimental thermal stress in field operations. Besides, the impact of mission profile dynamics on the accuracy of different thermal modeling approaches have not been analyzed. To address this issue, the model accuracy of two thermal stress modeling approaches for PV inverters are evaluated in this paper by comparing the thermal stress estimated from a thermal model with the experimental results under various mission profile dynamics. According to the results, the average error of the junction temperature estimation is 1.51 % for a transient thermal model and 2.08 % for a steady-state thermal model, respectively. On the other hand, the computational efficiency of the thermal stress modeling can be improved by more than a factor of three when using the steady-state thermal model.
KW - Insulated-gate bipolar transistor (IGBT)
KW - inverters
KW - mission profile
KW - Photovoltaic (PV) systems
KW - reliability
KW - thermal modeling
UR - http://www.scopus.com/inward/record.url?scp=85094892703&partnerID=8YFLogxK
U2 - 10.1109/ECCE44975.2020.9235750
DO - 10.1109/ECCE44975.2020.9235750
M3 - Conference contribution
AN - SCOPUS:85094892703
T3 - ECCE 2020 - IEEE Energy Conversion Congress and Exposition
SP - 5269
EP - 5275
BT - ECCE 2020 - IEEE Energy Conversion Congress and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020
Y2 - 11 October 2020 through 15 October 2020
ER -
