TY - GEN
T1 - High performance 4H-SiC emitter coupled logic circuits
AU - Elgabra, Hazem
AU - Singh, Shakti
PY - 2013
Y1 - 2013
N2 - The increasing demand for electronic devices and circuits dedicated to harsh environment applications, specifically high temperature and high power, has called for more research dedicated towards silicon carbide (SiC) devices and integrated circuits (ICs). SiC, a wide bandgap semiconductor, is inherently capable of operation in such environments. SiC bipolar transistors unlike MOSFETs, do not have any oxide layer under high electric field, and hence are not prone to reliability issues at high temperatures. In this paper, the design of optimized emitter coupled logic technology circuits using 4H-SiC bipolar transistors is presented. These circuits work over a wide range of temperatures and power supply voltages at high speeds, demonstrating the potential of robust high speed ECL integrated circuits in SiC.
AB - The increasing demand for electronic devices and circuits dedicated to harsh environment applications, specifically high temperature and high power, has called for more research dedicated towards silicon carbide (SiC) devices and integrated circuits (ICs). SiC, a wide bandgap semiconductor, is inherently capable of operation in such environments. SiC bipolar transistors unlike MOSFETs, do not have any oxide layer under high electric field, and hence are not prone to reliability issues at high temperatures. In this paper, the design of optimized emitter coupled logic technology circuits using 4H-SiC bipolar transistors is presented. These circuits work over a wide range of temperatures and power supply voltages at high speeds, demonstrating the potential of robust high speed ECL integrated circuits in SiC.
UR - http://www.scopus.com/inward/record.url?scp=84901413310&partnerID=8YFLogxK
U2 - 10.1109/ICECS.2013.6815364
DO - 10.1109/ICECS.2013.6815364
M3 - Conference contribution
AN - SCOPUS:84901413310
SN - 9781479924523
T3 - Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems
SP - 104
EP - 105
BT - 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems, ICECS 2013
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems, ICECS 2013
Y2 - 8 December 2013 through 11 December 2013
ER -